Integrated LED Package Structure With Transmissive BT Plate Lighting

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Solution Overview

Problem

Existing LED packaging structures have opaque front and back sides, limiting light emission to one side due to the lead frame obstruction, requiring twice the number of LED chips for full illumination and increasing costs, and involve complex PCB wiring and soldering, leading to high manufacturing costs.

Innovation Solution

An integrated LED package structure using a light-transmissive BT plate with LED chips on one side, allowing light transmission through the periphery and top end of the package colloid, and eliminating the need for a PCB by using quick connection cables and a self-controlled flash method.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If LED chips are packaged on both sides of the lead frame to achieve full illumination, then light emission completeness is improved, but the number of LED chips required doubles, increasing cost

Engineering Contradiction:
Improvelight emission completenessVSAvoidnumber of LED chips
Core Design Contradiction:
Illumination intensityVSQuantity of substance

Solution Approach 1:

The patent transitions from a two-sided packaging structure to a one-sided packaging structure with light transmission in multiple dimensions. The light-transmissive BT plate enables light to propagate through the plate and colloid in three-dimensional space, allowing single-sided chips to achieve comprehensive illumination that previously required dual-sided chips.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent changes the optical parameter of the BT plate from opaque to light-transmissive. This parameter change allows light to pass through the plate and colloid, transforming the light transmission path and enabling single-sided LED chips to illuminate areas that would otherwise require separate chips on the opposite side.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If complex PCB wiring and soldering are used to connect LED chips, then electrical connection reliability is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidPCB wiring complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the BT plate, lead frame, and sealing structure into an integrated package body. This consolidation eliminates the need for separate PCB wiring and soldering connections, as the integrated structure provides direct electrical pathways while maintaining connection reliability through the unified design.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The BT plate serves multiple functions simultaneously: it acts as a structural support, a light transmission medium, and an electrical connection carrier. This multi-functionality replaces the separate roles of PCB, wiring, and mounting structure, simplifying the overall system while maintaining reliability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances light-emitting efficiency, reduces production costs, simplifies the structure and connection, and facilitates regular port distribution while eliminating the need for external control ICs, resulting in a more practical and cost-effective LED light source.

Implementation Method 1

The BT plate is made of a light-transmissive material... allowing light transmission through the periphery and top end of the package colloid

Methodology Applied
Scientific EffectLight transmission: Light

Data Source

PatentUS12125837B1Integrated light emitting diode(LED) package structure light source
Publication Date: 2024.10.22 GUANGXI XINYI PHOYOELECTRIC TECH CO LTD
  • US12125837B1 patent drawing
  • US12125837B1 patent drawing
  • US12125837B1 patent drawing

AI summary

An integrated LED package structure light source includes: a plurality of LED package structure bodies. The plurality of LED package structure bodies each include a BT plate, a positive-electrode terminal, a negative-electrode terminal, LED light-emitting chips, a control integrated circuit (IC), and a package colloid. The BT plate is made of a light-transmissive BT material. The BT plate and an LED chip packaged on one side of the BT plate allow light of the LED chip to be transmitted through the periphery and top end of the package colloid and the back side of the BT plate, thereby improving the light-emitting dead angle, achieving comprehensive light-emitting, reducing the production cost, improving the device practicability, facilitating port distribution rules, and achieving the structure and connection simplicity. Moreover, LEDs can be directly and quickly connected through connection wires, and the external control IC is not required anymore, reducing the manufacturing cost.