LED Package Cavity Structure for Light Extraction and Heat Dissipation
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Solution Overview
Problem
Conventional light emitting device packages struggle with efficient light extraction and heat dissipation, leading to non-uniform surface light emission and reduced luminous flux.
Innovation Solution
A side-view type light emitting device package design featuring a circuit board with multiple light emitting device packages, a resin layer, and a diffusion or reflective layer, where the light emitting device packages have a cavity structure with lead frames and molding members for enhanced light emission and heat dissipation, along with a light blocking portion to control light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional light emitting device packages are used, then the structure is simple, but light extraction efficiency is poor and heat dissipation is insufficient
Solution Approach 1:
The package body is divided into multiple emission surfaces (front surface, side surfaces, and rear surface), allowing light to be extracted from multiple directions simultaneously. This segmentation of the emission function resolves the contradiction by maintaining structural simplicity while dramatically improving light extraction efficiency through multi-directional light output.
Solution Approach 2:
The invention transitions from conventional single-surface (2D) light emission to multi-surface (3D) light emission by opening the front surface, side surfaces, and rear surface of the package. This dimensional expansion allows light to propagate in multiple directions, significantly improving light extraction efficiency without complicating the basic package structure.
2Device complexity
If conventional light emitting device packages are used, then the device complexity is low, but heat dissipation performance is poor
Solution Approach 1:
The package structure is segmented into distinct functional regions: light-emitting regions (opened surfaces) and heat dissipation regions (side surfaces and rear surface). This segmentation allows simultaneous optimization of light extraction and heat dissipation functions without significantly increasing overall structural complexity.
Solution Approach 2:
The side surfaces and rear surface of the package serve dual functions: they act as heat dissipation pathways for thermal management and simultaneously serve as light emission surfaces. This multi-functionality resolves the contradiction by improving heat dissipation performance while maintaining relatively simple package structure.
3Ease of manufacture
If conventional light emitting device packages are used, then the manufacturing process is simple, but surface light uniformity is poor
Solution Approach 1:
Different surfaces of the package are optimized for different functions: the front surface is optimized for light emission, while the side surfaces and rear surface are optimized for both heat dissipation and light emission. This local quality differentiation allows each surface to be manufactured with specific characteristics, improving overall surface light uniformity while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves light extraction efficiency, heat dissipation, and uniformity of surface light emission, increasing the luminous flux and reliability of the light emitting device package and lighting device.
Implementation Method 1
a plurality of light emitting chips electrically connected to the plurality of frames on the bottom of the cavity
Implementation Method 2
a layer that diffuses or reflects light on the resin layer
Implementation Method 3
a layer that diffuses or reflects light on the resin layer
Implementation Method 4
a lighting device having a member disposed above a light emitting device package and blocking light emitted through a front surface and both side surfaces of the light emitting device package
Data Source
AI summary
The lighting device disclosed in the embodiment of the invention; a circuit board; a plurality of light emitting device packages disposed on the circuit board; a resin layer covering the plurality of light emitting device packages; and a layer for diffusing or reflecting light on the resin layer, wherein each light emitting device package includes a first side portion facing the circuit board, a second side portion opposite to the first side portion, third and fourth side portions on both sides of the first and second side portions, a cavity in which a part of a front side portion is opened; a plurality of lead frames each having a plurality of frames disposed on the bottom of the cavity and a bonding portion bent from each of the plurality of frames to a first side portion; and a plurality of light emitting chips electrically connected to the plurality of frames on the bottom of the cavity, and the cavity may have the same length as the length of the body in the first direction.