LED Package Protective Coating Resists Degradation
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Solution Overview
Problem
Conventional LED packages face issues with oxidative degradation, thermal degradation, and photodegradation due to high permeability of air and moisture through the transparent or translucent encapsulant materials, which are not adequately addressed by existing technologies.
Innovation Solution
A light emitting diode package with a protective coating applied to at least a portion of the surface, comprising a thin, translucent or transparent layer made of UV and/or heated cured silicone resin or epoxy resin, which reduces and/or eliminates oxidative, thermal, and photodegradation issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If transparent or translucent encapsulant materials are used to transmit light, then light transmission is improved, but air and moisture permeability increases leading to oxidative degradation
Solution Approach 1:
The patent applies composite materials by combining transparent encapsulant materials (epoxy resins or silicones) with a protective coating layer. The encapsulant provides light transmission while the protective coating layer (made of the same or different materials) provides barrier properties against air and moisture permeation, creating a composite structure that resolves the contradiction between light transmission and oxidative degradation resistance
Solution Approach 2:
The patent uses a thin protective coating layer applied over the encapsulant material. This thin film structure maintains the optical transparency needed for light transmission while providing a protective barrier that reduces air and moisture permeability, thereby preventing oxidative degradation of the LED package components
2Strength
If multiple interfaces are created between housing and encapsulant, then mechanical strength is improved, but air and moisture permeability increases
Solution Approach 1:
The protective coating layer acts as a continuous thin film barrier that spans across multiple interfaces between the housing and encapsulant. This coating seals the interface regions, preventing air and moisture from penetrating through the junctions while maintaining the mechanical strength provided by the multi-component structure
Solution Approach 2:
The patent creates a composite protective system where the housing, encapsulant, and protective coating form an integrated multi-material structure. The protective coating material is selected to be compatible with both the housing and encapsulant, creating strong adhesion at interfaces while providing moisture and air barrier properties
3Reliability
If protective coating is applied to reduce permeability, then oxidative degradation is reduced, but device complexity increases
Solution Approach 1:
The protective coating is applied as a thin film layer that can be deposited directly onto the encapsulant surface using standard coating techniques. This approach adds minimal structural complexity while providing effective protection against oxidative degradation, as the coating integrates seamlessly with the existing encapsulant structure
Solution Approach 2:
The protective coating serves as an intermediary layer between the encapsulant and the external environment. It mediates the interaction by providing a barrier function against oxygen and moisture while maintaining optical transparency, thus protecting the LED package without significantly complicating the overall device structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective coating significantly reduces air and moisture permeability, enhancing the durability and longevity of the LED package by minimizing degradation, while maintaining light transmission properties.
Implementation Method 1
The protective coating significantly reduces air and moisture permeability
Implementation Method 2
a thin, translucent or transparent layer made of UV and/or heated cured silicone resin or epoxy resin
Implementation Method 3
a thin, translucent or transparent layer made of UV and/or heated cured silicone resin or epoxy resin
Data Source
AI summary
A light emitting diode package, including: a housing, wherein the housing includes a top section having an aperture; a lead frame associated with the housing, wherein the lead frame includes a first electrode and a second electrode; a light emitting diode light source, wherein the light emitting diode light source is associated with the aperture of the housing; an encapsulant, wherein the encapsulant is associated with at least a portion of the light emitting diode light source and the housing; and a protective coating associated with at least a portion of the encapsulant and the housing, wherein the protective coating reduces and/or eliminates oxidative degradation, thermal degradation, and/or photodegradation.