LED Package Electrode Layout for Compact Full-Color Integration
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Solution Overview
Problem
Existing light emitting diode (LED) devices have complex manufacturing processes due to the need for separate production and mounting of individual color LEDs, which complicates the creation of high-resolution devices in small areas.
Innovation Solution
A light emitting device package with a simple structure featuring a printed circuit board, epitaxial stacks emitting different wavelength bands, and a molding layer that partially reflects, scatters, or absorbs external light, allowing for the integration of multiple colors in a compact form by stacking and overlapping epitaxial stacks on a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual color LEDs are produced and mounted separately, then each LED can be optimized for its specific wavelength, but the manufacturing process becomes complex and the device area increases
Solution Approach 1:
The patent combines multiple individual LED chips (red, green, blue LEDs) into a single integrated light emitting device package. This merging approach maintains the wavelength optimization benefits of individual LEDs while simplifying the manufacturing process by producing one integrated unit rather than requiring separate production and mounting of multiple individual LEDs.
Solution Approach 2:
The integrated light emitting device package serves multiple functions simultaneously by incorporating different wavelength LEDs (red, green, blue) within a single package. This multi-functional design allows the device to emit multiple colors and achieve full color capability while reducing overall device complexity and manufacturing steps.
2Manufacturing precision
If multiple individual LEDs are mounted separately, then each LED can be independently optimized, but the device area becomes large
Solution Approach 1:
The patent employs a nested structure where multiple LED chips are placed in close proximity within a single package, with some LEDs positioned on different layers or planes. This nesting arrangement allows multiple optimized LEDs to coexist in a compact space, significantly reducing the overall device area compared to separate mounting while maintaining individual LED optimization.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by positioning LEDs at different heights and angles within the package, rather than simply arranging them in a two-dimensional plane. This dimensional approach allows for more compact integration of multiple optimized LEDs, reducing the footprint area while preserving individual LED performance.
3Ease of manufacture
If a simple LED structure is used, then manufacturing is easier, but light control and external light reflection management become difficult
Solution Approach 1:
The patent introduces a reflective layer as an intermediary component within the simple LED package structure. This reflective layer serves as a mediator that manages external light reflection by directing incident light toward the LEDs or controlling its distribution, thereby addressing the harmful reflection effect while maintaining the overall simplicity of the package design.
Solution Approach 2:
The patent utilizes the inherent color-emitting properties of different LED chips (red, green, blue) to control and manage light interactions within the package. By strategically positioning these color-specific LEDs and combining their emissions, the device achieves effective light control and reflection management through color-based optical manipulation rather than requiring complex additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the manufacturing process and enables the production of high-resolution devices with full color in smaller areas, improving the integration and miniaturization of light emitting devices while controlling light intensity and reducing external light reflection.
Implementation Method 1
the molding layer covers an upper surface of the substrate and partially reflect, scatter, or absorb external light
Implementation Method 2
the molding layer covers an upper surface of the substrate and partially reflect, scatter, or absorb external light
Implementation Method 3
the molding layer covers an upper surface of the substrate and partially reflect, scatter, or absorb external light
Implementation Method 4
at least one light emitting device disposed on the front surface and emitting light in a direction toward the front surface
Implementation Method 5
the light emitting structure disposed on the printed circuit board, a substrate disposed on the light emitting structure
Data Source
AI summary
A light module including a base substrate having a front surface, first and second electrodes disposed on the front surface, first and second emitters disposed on the front surface, a first molding covering the first emitter, and a second molding layer covering the second emitter, in which the first and second electrodes include a first region and a second region exposed from the base substrate, and an embedded region between the first region and the second region and not exposed to the outside, and a distance between the second region of the first electrode is connected to the first emitter and the second region of the second electrode connected to the second emitter is shorter than a distance between the first region of the first electrode connected to the first emitter and the first region of the second electrode connected the second emitter.