LED Package Color Mixing via Chip Selection
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Solution Overview
Problem
Existing methods for manufacturing light-emitting device packages face challenges in reducing color variation between chips, leading to increased defective proportions, reduced productivity, and decreased production yield due to variations in manufacturing processes.
Innovation Solution
The solution involves a light-emitting device package with multiple chips arranged in a checkerboard or matrix pattern on a substrate, each with independent fluorescent layers, where chips are classified and selected based on color temperatures within ±250K of a target color, allowing for the combination of colors to produce a consistent hue and temperature, thereby reducing color variation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If single chip packages are manufactured and arrayed using typical methods, then manufacturing process is simple, but color variation between chips increases
Solution Approach 1:
The patent combines multiple light-emitting chips (typically 3-9 chips) into a single package module. By merging chips with slightly different color characteristics (color temperatures within ±250K of target), the package achieves consistent target color output through optical mixing, resolving the contradiction between manufacturing simplicity and color consistency.
Solution Approach 2:
The patent changes the color temperature parameter selection criteria by accepting chips within a range (±250K) rather than requiring exact matches. This parameter change allows greater manufacturing flexibility while maintaining consistent perceived color through the combination effect, addressing the contradiction between ease of manufacture and manufacturing precision.
2Manufacturing precision
If chips are classified and selected based on color temperatures within ±250K of target color, then color variation is reduced, but classification and selection complexity increases
Solution Approach 1:
The patent simplifies the classification process by establishing a clear parameter range (±250K from target color temperature) rather than requiring complex multi-dimensional color matching. This parameter-based classification approach reduces selection complexity while maintaining color consistency, resolving the contradiction between manufacturing precision and device complexity.
3Manufacturing precision
If multiple chips are combined in a package, then color variation is reduced, but device structure becomes more complex
Solution Approach 1:
The patent merges multiple light-emitting chips and their individual fluorescent layers into an integrated package structure. This merging achieves color consistency through optical mixing of multiple light sources while managing structural complexity through systematic arrangement and common packaging, resolving the contradiction between color consistency and structural simplicity.
Solution Approach 2:
The patent creates a universal package structure that can accommodate multiple chips with slightly varying characteristics. The package design allows different chip combinations to achieve the same target color, providing multi-functionality and flexibility that manages structural complexity while maintaining color consistency across different configurations.
4Manufacturing precision
If rigorous production management is implemented to reduce color variation, then color consistency improves, but productivity decreases
Solution Approach 1:
The patent changes the production approach from requiring exact color matching to accepting a range (±250K). This parameter relaxation reduces the need for rigorous production management and rework, thereby improving productivity while maintaining color consistency through the combination effect of multiple chips.
Solution Approach 2:
The patent converts the harmful effect of color variation in individual chips into a beneficial effect by combining chips with different color characteristics. The variations that would normally be defects are transformed into complementary elements that, when combined, produce consistent target color output, improving productivity without sacrificing color consistency.
5Loss of substance
If chips with color variations are used, then more chips can be utilized (reducing waste), but color consistency deteriorates
Solution Approach 1:
The patent converts chips with color variations (which would normally be considered defective or wasted) into useful components. By combining chips with color temperatures within ±250K of the target, the patent transforms what would be discarded variations into complementary elements that collectively produce consistent target color, reducing chip waste while maintaining color consistency.
Solution Approach 2:
The patent merges chips with different color characteristics into a unified package output. Through optical mixing of light from multiple chips with varying colors, the package achieves consistent target color perception, allowing utilization of chips that would otherwise be wasted due to color variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces color variation between light-emitting chips, increases productivity, and improves production yield by utilizing chips that would otherwise be classified as defective, allowing for the realization of a desired color through combinations of light emitted from the chips.
Implementation Method 1
Light-emitting devices such as light emitting diodes (LEDs) and laser diodes (LDs) utilize an electroluminescence phenomenon, that is, a phenomenon in which light is emitted from a material (semiconductor) by applying a current or voltage to the material.
Implementation Method 2
a fluorescent layer may be coated on the light-emitting chip
Data Source
AI summary
Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color.