LED Package Compound W-Shape for Slicing Spatter
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Solution Overview
Problem
Conventional LED package structures face inefficiencies in lighting performance and are prone to spattering during the slicing process of substrate assembly.
Innovation Solution
The proposed LED package structure incorporates a specific configuration of a package compound with a W-shaped cross section, where the package compound is dispensed around the lighting diode and substrate, and a manufacturing method that includes slicing steps to prevent spattering, using a carrier module with electrodes, solder pads, and annular walls, and embedding conductive pillars for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a conventional package structure with fully filled package compound is used, then the package structure is simple to manufacture, but the lighting efficiency is reduced
Solution Approach 1:
The package compound is divided into multiple regions with different functions: a first package compound region filled in the accommodating space, and a second package compound region formed on the lighting diode. This segmentation allows different optical properties in different areas, improving light extraction efficiency while maintaining structural integrity.
Solution Approach 2:
Different regions of the package compound are given different properties: the first region provides structural support and basic encapsulation, while the second region on the lighting diode is optimized for light extraction and emission. This local differentiation of material properties enhances overall lighting efficiency without compromising package strength.
2Use of energy by moving object
If the package compound is dispensed around the lighting diode and substrate, then the lighting efficiency is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The substrate assembly is prepared in advance with pre-formed annular walls and defined accommodating spaces before package compound dispensing. This preliminary structuring guides the package compound placement and simplifies the subsequent dispensing process, making the enhanced manufacturing process more controllable and repeatable.
Solution Approach 2:
The annular walls serve as intermediaries that define the accommodating space and guide the package compound dispensing process. These walls act as physical boundaries that ensure precise placement of the package compound around the lighting diode and substrate, simplifying the manufacturing process.
3Reliability
If conventional slicing process is used on substrate assembly, then the manufacturing is simple, but spattering occurs during slicing
Solution Approach 1:
The package compound is dispensed to completely fill the accommodating space defined by the annular walls before the slicing process. This prior cushioning of the substrate assembly with solidified package compound prevents spattering during slicing by providing structural support and damping vibrations that would otherwise cause material to scatter.
Solution Approach 2:
The package compound is used to counteract the harmful spattering effect before it can occur during slicing. By filling the accommodating space and providing structural integrity to the substrate assembly, the package compound prevents the spattering that would normally occur during the slicing process.
Data Source
AI summary
An package structure includes a substrate, a pair of electrodes and a solder pad layer both electrically connected to each other and respectively disposed on two opposite surfaces of the substrate, a lighting diode arranged above the substrate and electrically connected to the pair of electrodes, a wall disposed on the substrate and arranged around the lighting diode, and a package compound disposed inside of the wall and covering the lighting diode. The package compound includes an attaching portion disposed on a top surface of the lighting diode, and a surrounding portion arranged around the attaching portion. The surrounding portion has an annular slot arranged on a top surface thereof. A bottom end of the annular slot is located at a position aligning with 25%˜90% of a thickness of the lighting diode along a height direction.