LED Package Conductive Pad Substrate Eliminating Wire Bonding
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Solution Overview
Problem
Conventional light emitting device packages require space for wire bonding, leading to increased size and reduced reliability due to potential short circuits or disconnections, and are not suitable for mass production, especially when applying phosphors and achieving uniform light extraction.
Innovation Solution
A light emitting device package with a conductive pad and electrode pads on the substrate, surrounded by a light transmitting material film, allowing for conductive lines to connect the pads without wire bonding, enabling reduced package size, improved reliability, and easier phosphor application, while eliminating the need for additional passivation films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to electrically connect the light emitting device to other devices, then electrical connection is achieved, but the package size increases and reliability decreases due to potential short circuits or disconnections
Solution Approach 1:
The patent removes the wire bonding process entirely from the packaging structure. Instead of using separate wires to connect electrode pads to external circuits, the invention integrates the electrical connection function directly into the packaging substrate through conductive traces, eliminating the need for wire bonding and its associated reliability issues
Solution Approach 2:
The patent combines multiple functions into the packaging substrate: mechanical support, electrical connection through integrated conductive traces, and structural protection. By merging the substrate's role to include both mechanical and electrical functions, the design eliminates wire bonding while maintaining electrical connectivity
2Productivity
If wire bonding is used for electrical connection, then electrical connectivity is established, but the manufacturing process becomes complex and unsuitable for mass production
Solution Approach 1:
The patent replaces the mechanical wire bonding process with a planar integrated circuit approach where conductive traces are formed on the substrate during standard PCB manufacturing processes. This substitution eliminates the need for delicate wire manipulation and bonding operations, enabling automated mass production
Solution Approach 2:
The packaging substrate is designed to serve multiple purposes: providing mechanical support, enabling electrical connection through integrated traces, and facilitating heat dissipation. This multi-functional design simplifies the overall manufacturing process by eliminating the need for separate wire bonding steps
3Reliability
If additional passivation films are applied to protect the light emitting device, then device protection is improved, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The packaging substrate is designed to provide both mechanical support and electrical insulation functions simultaneously. By making the substrate itself electrically insulating while providing integrated conductive traces for connection, the design eliminates the need for additional passivation films, simplifying the manufacturing process
Data Source
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AI summary
The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing the size of a package. The present invention has advantages in that there is no wire in a light emitting device by using a conductive interconnection portion so that a phosphor can be easily and uniformly applied, and an area where vertically emitted light is absorbed can be reduced so that light extraction of a device can be enhanced.