LED Package Conductive Structures Prevent Shift During Molding
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Solution Overview
Problem
In the manufacturing of light-emitting diode (LED) packages, the curing of molding compounds leads to deformation, causing LEDs to shift, which complicates the subsequent electrical connection process and may result in broken circuits, necessitating rework or scrapping of packages.
Innovation Solution
A method where conductive connection structures are formed before removing any part of the substrate, ensuring the molding compound and encapsulating member remain attached, thus maintaining the position of LEDs and simplifying the manufacturing process by preventing shifts during patterning and connection formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the molding compound is cured to protect the LEDs, then the LEDs are protected, but the molding compound deforms causing LEDs to shift
Solution Approach 1:
The patent applies preliminary action by forming the conductive connection structures on the substrate before removing the substrate. This ensures that the connection structures are already in place and properly positioned before any substrate removal occurs, preventing LED position shifts from affecting circuit alignment. The conductive connection structures are formed while the molding compound is still attached to the substrate, maintaining stable positioning throughout the connection formation process.
2Ease of manufacture
If the cured molding compound is separated from the mold to make the circuit, then the circuit can be manufactured, but the molding compound deforms and LEDs shift
Solution Approach 1:
The patent forms the conductive connection structures on the substrate before substrate removal, ensuring that all connection work is completed while the molding compound is still supported and stable. This preliminary formation of connections eliminates the need to separate the molding compound from the mold before circuit manufacturing, allowing both ease of manufacture and manufacturing precision to be maintained.
Solution Approach 2:
The substrate serves as an intermediary support structure that maintains the molding compound in a stable state during the circuit formation process. By keeping the molding compound attached to the substrate throughout the connection structure formation, the substrate acts as a mediator that prevents deformation while allowing circuit manufacturing to proceed.
3Reliability
If process parameters are adjusted to account for LED shifts, then circuit connection may be achieved, but production time increases due to rework
Solution Approach 1:
The patent forms conductive connection structures that extend beyond the molding compound boundaries on the substrate before substrate removal. This preliminary extension ensures that connection points are already established and accessible, eliminating the need for subsequent rework or parameter adjustments to compensate for LED position shifts, thereby maintaining high productivity while ensuring reliable circuit connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces or prevents LED shifts, simplifies the manufacturing process, and shortens production time by eliminating the need to adjust process parameters for shifts, thereby improving yield and reducing rework.
Implementation Method 1
a molding compound is formed on the substrate, in which the molding compound covers the light-emitting components, the first electrode pads, and the second electrode pads
Data Source
AI summary
A light-emitting package includes an encapsulating member, a plurality of light-emitting components disposed in the encapsulating member, a plurality of first electrode pads, a plurality of second electrode pads, and a plurality of conductive connection structures. The encapsulating member has a first surface and a second surface opposite to each other. Each light-emitting component has a light-emitting surface exposed on the first surface. Both the first electrode pads and the second electrode pads are exposed on the second surface. A first bonding surface of each first electrode pad and a second bonding surface of each second electrode pad are both flush with the second surface. The light-emitting components disposed on the first electrode pads are electrically connected to the first electrode pads. The conductive connection structures passing through the encapsulating member are electrically connected to the light-emitting components and the second electrode pads.