LED Package Conductive Structures for Cost and Heat
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Solution Overview
Problem
Conventional LED packages with metallic electrode pads, such as Au or Ag, incur high manufacturing costs and inefficient heat radiation due to the large number of pads required for hundreds to thousands of LED chips, leading to decreased brightness and lifespan.
Innovation Solution
The use of conductive structures formed from silicon or aluminum on a printed circuit board (PCB) instead of metallic electrode pads, allowing for reduced material costs and enhanced heat radiation through thicker conductive structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metallic electrode pads (Au or Ag) are used on the PCB, then electrical connection is achieved, but manufacturing cost increases significantly
Solution Approach 1:
The patent replaces expensive metallic electrode pads (Au or Ag) with inexpensive conductive structures made of silicon or aluminum. These conductive structures serve the same electrical connection function but are made from much cheaper materials, directly reducing manufacturing cost while maintaining the required number of connections for hundreds to thousands of LED chips
Solution Approach 2:
The patent changes the material parameter of the electrode pads from precious metals (Au/Ag) to common conductive materials (silicon or aluminum). This parameter change maintains electrical conductivity while dramatically reducing material cost. The thickness parameter is also optimized to several hundred μm to ensure sufficient electrical and thermal performance
2Temperature
If metallic electrode pads are used, then electrical connection is established, but heat radiation from LED chips is inefficient
Solution Approach 1:
The patent replaces metallic electrode pads with conductive structures made of silicon or aluminum that have superior thermal conductivity properties. These structures not only provide electrical connection but also serve as effective heat dissipation paths, radiating heat from the LED chips more efficiently than traditional metallic pads
Solution Approach 2:
The conductive structures are formed as composite integrations with the PCB, combining electrical conductivity and thermal radiation properties in a single structure. The silicon or aluminum conductive structures are embedded in or integrated with the PCB substrate, creating a composite system that simultaneously handles both electrical connection and heat dissipation functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs and improves heat radiation performance, extending the lifespan and brightness of LED chips by using cheaper silicon or aluminum structures as electrode pads on the PCB.
Implementation Method 1
the conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure
Implementation Method 2
LED is a semiconductor element which converts electric energy into light energy
Data Source
AI summary
Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electrically connected to the PCB through the conductive structure.