LED Package Structure Enhancing Contrast via Reflective Encapsulation
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Solution Overview
Problem
Current light-emitting diode (LED) package structures lack high contrast properties, which limits their competitiveness in display applications.
Innovation Solution
A manufacturing method and package structure design that includes defining visual units with a photoelectric element and a surrounding area on a substrate, where the visual unit is encapsulated with a material that increases average reflectance inside the encapsulation element compared to outside, enhancing contrast through the use of light reflective and absorption layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional LED package structures are used, then manufacturing simplicity is maintained, but contrast property is insufficient
Solution Approach 1:
The patent applies local quality by creating distinct light reflective and light absorptive regions within the visual unit. The first area contains light reflective layers that reflect light to create bright zones, while the second area contains light absorptive layers that absorb light to create dark zones. This spatial differentiation of optical properties directly enhances the contrast property of the LED package structure.
Solution Approach 2:
The patent employs composite materials by combining light reflective layers and light absorptive layers within the same visual unit. These layers are integrated into the package structure alongside the LED chip and encapsulant, creating a composite system that simultaneously achieves high contrast performance and functional integration without requiring separate components.
2Illumination intensity
If light reflective and absorptive layers are added to enhance contrast, then display performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the contrast enhancement function with the existing LED package structure by integrating light reflective and absorptive layers directly into the visual unit during the encapsulation process. This combining approach allows contrast enhancement to be achieved without adding separate manufacturing steps or components, thereby maintaining ease of manufacture while improving display performance.
Solution Approach 2:
The encapsulant material serves multiple functions: it protects the LED chip, provides optical coupling, and when combined with light reflective and absorptive layers, it creates high contrast display regions. This multi-functionality reduces the need for additional specialized components and simplifies the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a high contrast property in LED package structures, improving their competitiveness by creating distinct bright and dark zones within the visual units, thereby enhancing display performance.
Implementation Method 1
disposing a plurality of encapsulation elements on the mother substrate, wherein the encapsulation elements completely cover the first areas of the visual units, respectively, and overlap the corresponding ones of the patterned circuits, such that the average reflectance inside each encapsulation element is greater than the average reflectance outside the encapsulation element
Implementation Method 2
forming a plurality of light reflective layers on the mother substrate, wherein each light reflective layer is disposed above or below the wire layer, and at least a part of the light reflective layer defines the first area of the visual unit
Implementation Method 3
forming a plurality of light absorption layers on the mother substrate, wherein each light absorption layer is disposed along the periphery of the first area of each visual unit and encompassing the first area of each visual unit, and the light absorption layer defines the second area of the visual unit
Data Source
AI summary
A package structure and an electronic device including the package structure are disclosed. The package structure includes a substrate, a wire layer disposed on the substrate, a visual unit disposed on the substrate, and an encapsulation element disposed on the substrate. The wire layer includes a plurality of patterned circuits. The visual unit includes a first area and a second area defined along a periphery of the first area. The first area is configured with a photoelectric element, and the photoelectric element is electrically connected to and disposed corresponding to at least one of the patterned circuits. The encapsulation element completely covers the first area of the visual unit and overlaps the corresponding patterned circuit, such that an average reflectance inside the encapsulation element is greater than an average reflectance outside the encapsulation element.