LED Package Structure With Copper Heat Paths and No Sealing Film
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Solution Overview
Problem
Existing LED package manufacturing methods are complex and prone to die shift during the pick-and-place process, and the sealing film material can absorb light and hinder heat dissipation, reducing efficiency.
Innovation Solution
A light-emitting diode package structure that includes a heat dissipation substrate with copper blocks and a heat-conducting material layer, a redistribution layer electrically connected to the copper blocks, and light-emitting diodes disposed on the redistribution layer without contact with any components on the side away from the redistribution layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If pick-and-place process is used to transfer individual LEDs to package casing, then LED packaging can be completed, but die shift occurs during the process
Solution Approach 1:
The patent segments the manufacturing process by keeping multiple LEDs on the wafer together through the redistribution layer formation process, rather than separating and repositioning individual LEDs. This segmentation approach eliminates the pick-and-place step that causes die shift, while still allowing individual LED packaging later.
Solution Approach 2:
The patent merges the redistribution layer formation with the wafer-level processing, combining multiple LED interconnections into a single integrated structure before final packaging. This merging eliminates the need for separate pick-and-place operations, preventing die shift while achieving the same functional result.
2Reliability
If sealing film material is used to protect multiple LEDs on wafer, then LED protection is achieved, but light absorption occurs and heat dissipation efficiency is reduced
Solution Approach 1:
The patent extracts the protective function from the sealing film material and integrates it directly into the redistribution layer structure. By incorporating protection features into the functional interconnection layer itself, the separate sealing film is eliminated, removing the light-absorbing and heat-trapping element while maintaining LED protection.
Solution Approach 2:
The redistribution layer is designed to serve multiple functions simultaneously: electrical interconnection, mechanical support, and protective enclosure. This multi-functionality eliminates the need for separate sealing film material, thereby removing the source of light absorption and heat dissipation issues while maintaining all necessary protection functions.
3Reliability
If sealing film material is used to protect LEDs, then LED protection is achieved, but optical power output per unit area is reduced
Solution Approach 1:
The protective function is extracted from the sealing film and integrated into the redistribution layer, eliminating the light-absorbing sealing material that reduced optical power output. This extraction maintains LED protection while removing the obstacle to light emission.
Solution Approach 2:
The patent eliminates the sealing film material that had light-absorbing properties, thereby removing the spectral filtering and intensity reduction effects. The redistributed layer structure allows full-spectrum light transmission, restoring maximum optical power output per unit area while maintaining protection.
4Ease of manufacture
If complex manufacturing process steps are used, then LED packaging can be completed, but process complexity increases
Solution Approach 1:
The patent merges multiple separate manufacturing steps into integrated wafer-level processes. The redistribution layer formation combines interconnection creation, mechanical support establishment, and protection integration into a single continuous process, eliminating the need for separate pick-and-place, bonding, and sealing operations.
Solution Approach 2:
The patent performs preliminary actions at the wafer level before final packaging, including redistribution layer formation and interconnection establishment. By completing these complex operations while LEDs remain on the wafer in a controlled environment, the subsequent packaging steps are simplified, reducing overall process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation efficiency, reduces die shift, and increases optical power output per unit area by simplifying the manufacturing process and eliminating the need for sealing film material.
Implementation Method 1
The heat dissipation substrate includes multiple copper blocks and a heat-conducting material layer. The copper blocks penetrate the heat-conducting material layer.
Data Source
AI summary
A light-emitting diode package structure includes a heat dissipation substrate, a redistribution layer, and multiple light-emitting diodes. The heat dissipation substrate includes multiple copper blocks and a heat-conducting material layer. The copper blocks penetrate the heat-conducting material layer. The redistribution layer is disposed on the heat dissipation substrate and electrically connected to the copper blocks. The light-emitting diodes are disposed on the redistribution layer and are electrically connected to the redistribution layer. A side of the light-emitting diodes away from the redistribution layer is not in contact with any component.