LED Resin Package Recess Structure for Cover Adhesion

The covering member extends not only horizontally over the leads but also vertically into the resin recess, utilizing the third dimension (depth) to increase adhesion area. This dimensional extension allows the covering member to anchor into the recessed area, creating mechanical interlocking that prevents separation while maintaining manufacturing feasibility through a single molding process.

The covering member is designed with a differentiated structure where portions extend into different regions: some portions cover the upper surfaces of the leads while other portions extend into the resin recess. This segmentation of functional zones allows the covering member to simultaneously provide electrical shielding over the leads and mechanical anchoring in the resin, resolving the adhesion issue without complicating manufacturing.

The resin recess creates a curved or concave geometry that allows the covering member to wrap around and anchor into the recessed area. This curved surface configuration increases the contact area and mechanical interlocking between the covering member and resin portion, preventing separation while adding minimal structural complexity compared to a completely flat surface.

By introducing vertical depth through the resin recess, the design transforms a two-dimensional flat surface into a three-dimensional anchoring structure. This dimensional change provides additional adhesion area and mechanical interlocking without significantly increasing overall device complexity, as the recess is formed within the existing resin package geometry.

The resin recess acts as a pre-designed stress absorption zone that cushions mechanical stresses before they can propagate through the resin portion. By anticipating stress concentration issues, the design incorporates the recess to distribute and absorb stresses, preventing crack formation while maintaining manufacturing simplicity through integration into the molding process.

The vertical extension of the covering member into the resin recess creates a three-dimensional stress distribution pattern that prevents stress concentration in the resin. This dimensional approach allows stresses to be distributed throughout the volume of the recess rather than concentrated at surface level, enhancing crack resistance without complicating manufacturing.