LED Package with Dented Body for Multi-Color Emission
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Solution Overview
Problem
Existing LED packages face challenges in generating multiple colors of light while maintaining strong coupling with the package body and preventing moisture invasion.
Innovation Solution
A light emitting diode package design featuring a first chip emitting red light and a second chip emitting amber light, with a specific lead frame configuration and Zener diodes for enhanced electrical connections, and a semiconductor layer composition that includes AlGaInP, AlN, and other materials to achieve efficient color emission and moisture protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple light emitting chips are mounted to generate two or more colors of light, then color variety is improved, but device complexity and occupation area increase
Solution Approach 1:
The patent combines multiple light emitting chips (first light emitting chip and second light emitting chip with different wavelengths) into a single LED package structure, merging their functions while maintaining individual electrical connections through separate lead frames and wires to achieve multiple colors without proportionally increasing device complexity
Solution Approach 2:
The LED package is designed with multi-functionality by incorporating both first and second light emitting chips that can emit different colors of light, allowing the same package structure to serve multiple lighting functions simultaneously through selective activation of different chips
2Reliability
If light emitting chips are mounted on package body, then light emission function is achieved, but coupling strength with package body may be insufficient
Solution Approach 1:
The patent employs a dented portion (concave structure) in the package body that receives and couples with the light emitting chip, creating enhanced mechanical interlocking through the curved/dented geometry that improves coupling strength beyond flat surface mounting
Solution Approach 2:
The light emitting chip is nested within the dented portion of the package body, with the chip positioned inside the recessed area, creating a nested structure that enhances mechanical coupling and structural integration between the chip and package body
3Adaptability or versatility
If lead frames are configured for multiple chips, then electrical connection capability is improved, but moisture invasion risk increases
Solution Approach 1:
The patent uses a sealing structure (mold compound or sealant) that forms a protective shell enclosing the lead frames and light emitting chips, creating a moisture barrier that prevents harmful factors while maintaining electrical connection capabilities through the sealed configuration
Solution Approach 2:
The sealing structure is applied in advance to cover and protect the lead frames and chips from moisture invasion before the device is put into service, preventing harmful effects rather than addressing them after they occur
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables the emission of two or more colors of light with reduced chip count, improved coupling strength, and effective moisture prevention, enhancing the reliability and performance of LED packages.
Implementation Method 1
LEDs are elements that change electrical signals into infrared light or other light using compound semiconductor properties
Implementation Method 2
The first light emitting chip may be configured to emit red light having a wavelength range of 600nm∼690nm, and the second light emitting chip may be configured to emit amber light having a wavelength range of 550nm∼600nm
Data Source
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AI summary
One embodiment comprises first and second light-emitting chips, each comprising: a package body having a cavity; first to fourth lead frames disposed inside the package body; a first semiconductor layer; an active layer; and a second semiconductor layer and emitting light of a different wavelength from each other, wherein each of the first to fourth lead frames comprises: an upper surface part exposed to the cavity; and a side surface part bent from one side portion of the upper surface part and exposed by one surface of the package body. In addition, the first light-emitting chip is disposed on the upper surface part of the first lead frame, and the second light-emitting chip is disposed on the upper surface part of the third lead frame.