LED Package With Diamond Substrate and Micro-Vias
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Solution Overview
Problem
Existing LED packages are inefficient in transferring heat due to poorly suited materials for thermal conductivity, limiting the size and power of high-brightness LED chips, especially in compact designs for portable devices.
Innovation Solution
A high-brightness LED module with a substrate having a recess and through-holes filled with conducting material, allowing for improved heat transfer and electrical isolation, using a silicon substrate and reflective coatings to enhance light output and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If highly thermally conductive material such as metal mounts are used to transfer heat from the LED chip, then heat transfer efficiency is improved, but electrical isolation of contacts becomes difficult and device complexity increases
Solution Approach 1:
The patent uses a composite structure combining diamond material (high thermal conductivity) with electrically insulating properties, eliminating the need for separate metal mounts and electrical isolation structures. The diamond material simultaneously provides both heat transfer and electrical isolation functions, resolving the contradiction between thermal performance and device complexity.
2Reliability
If traditional LED package structures with multiple components are used, then electrical isolation is achieved, but package size becomes large and thermal conductivity is poor
Solution Approach 1:
The patent merges the substrate, mount, and heat sink functions into a single integrated diamond substrate structure. This consolidation eliminates multiple separate components, reducing package area while maintaining electrical isolation through the inherently insulating properties of the diamond material and its structural design.
3Area of stationary object
If LED package size is reduced for compact portable designs, then portability is improved, but heat transfer capability and power handling are limited
Solution Approach 1:
The patent changes the material parameter from traditional metals or ceramics to diamond material, which has exceptionally high thermal conductivity. This parameter change enables the package to maintain superior heat transfer capability in a reduced size, as diamond's thermal conductivity is significantly higher than conventional materials, allowing efficient heat dissipation from high-power LED chips in compact configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat transfer and increased light output while maintaining electrical isolation, allowing for smaller, more powerful LED packages suitable for compact designs.
Implementation Method 1
At least two through-holes filled with electrically conducting material (also referred to as micro-vias or through-contacts) are disposed in the membrane to electrically connect the light emitting element to the exterior of the package
Implementation Method 2
the combination of the LED substrate, the submount and the package material are poorly suited for transferring heat from the LED chip to the surroundings
Implementation Method 3
using a silicon substrate and reflective coatings to enhance light output and thermal conductivity
Data Source
AI summary
A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.