LED Package Base With Dielectric Isolations For Thermal Dissipation
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Solution Overview
Problem
Conventional LED packages face challenges in light distribution and thermal management, leading to performance degradation and potential damage due to insufficient thermal dissipation, which can be costly to address with additional substrates.
Innovation Solution
A method and structure for an LED package base using a metal core substrate with dielectric isolations and conductive vias to improve thermal dissipation and light distribution, where the substrate is divided into portions serving as electrodes, and a conductive layer forms circuit contacts with a thermal projection for efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a substrate is used to improve thermal dissipation, then thermal management is enhanced, but the cost of the LED package increases
Solution Approach 1:
The patent merges the substrate function with the package base by integrating a metal core substrate directly into the package base structure. The package base itself becomes the thermal management component, eliminating the need for a separate substrate. This is achieved by forming the metal core substrate as an integral part of the package base, where the base includes a recess that receives and bonds to the LED chip, with the metal core providing both structural support and thermal dissipation pathways.
Solution Approach 2:
The package base is designed to perform multiple functions simultaneously: it provides mechanical support for the LED chip, serves as a thermal management system through its metal core substrate, and acts as a mounting structure. The metal core substrate within the package base performs both structural and thermal functions, reducing the need for additional components and lowering overall package complexity and cost.
2Ease of manufacture
If conventional LED package structure is used, then manufacturing is simpler, but light distribution and thermal management are insufficient
Solution Approach 1:
The package base is segmented into distinct functional zones: a metal core substrate region for thermal management, a recess region for LED chip mounting, and bonding regions. The metal core substrate is divided into a first portion and second portion separated by a first interface, allowing optimized thermal pathways. This segmentation enables each region to perform its specific function efficiently while maintaining manufacturability through standardized fabrication processes.
Solution Approach 2:
The package base employs composite material construction, combining the metal core substrate (for thermal conductivity) with the package base material (for structural support). The metal core substrate is bonded to the package base through bonding material, creating a composite structure that leverages the thermal properties of metal and the mechanical properties of the base material, achieving both thermal management and structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal dissipation and light distribution, reducing the risk of overheating and performance degradation while potentially lowering costs by integrating thermal management within the package design.
Implementation Method 1
a metal core substrate having a top surface and a bottom surface
Implementation Method 2
forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further comprises filling in the first trenches with first dielectric material to form dielectric isolations
Implementation Method 3
at least two conductive vias formed through the conductive layer and the dielectric layer. The conductive vias comprises a second conductive material. Each conductive via connects a circuit contact to a metal core portion
Data Source
AI summary
A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface. The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.