LED Package Carrier Dome Surface Heat Dissipation
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Solution Overview
Problem
Conventional LED packages face inefficiencies in heat dissipation and optical transmission due to the use of optical lenses, which can cause secondary optical effects and block heat energy from being dissipated outside, affecting the luminous efficiency and lifespan of LEDs.
Innovation Solution
An LED package design featuring a carrier with a dome-like upper surface and through holes for conductive wire units, providing high thermal conductivity and electrical insulation, along with optional reflective films and cooling fins, allows for direct heat dissipation and optical diffusing or condensing functions without the need for an optical lens.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If an optical lens is added on the optical path to condense or diffuse light beams, then the optical field pattern meets application requirements, but secondary optical effects (reflection, refraction, absorption) reduce optical transmission efficiency
Solution Approach 1:
The patent extracts and removes the optical lens from the system. Instead of using a separate optical lens component to condense or diffuse light, the invention integrates the optical function directly into the substrate through patterned structures (transparent conductive oxide patterns, metal electrode patterns) that achieve the desired optical field pattern without causing secondary optical effects like reflection, refraction, and absorption
Solution Approach 2:
The patent merges the optical control function with the substrate structure. The substrate is designed with integrated patterns (transparent conductive oxide patterns, metal electrode patterns) that simultaneously serve as both the structural base and the optical control element, eliminating the need for a separate optical lens and thereby reducing optical energy loss
2Reliability
If the optical lens is sealed on the substrate hermetically, then the optical structure is protected, but gas remains between the lens and substrate blocking heat dissipation
Solution Approach 1:
The patent removes the hermetically sealed optical lens from the structure. By eliminating the lens entirely and using integrated substrate patterns for optical control, the sealed cavity that trapped gas and blocked heat dissipation is removed, allowing direct heat dissipation from the LED to the substrate and then to the environment
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: it provides mechanical support, enables heat dissipation through direct thermal contact with the LED, and controls the optical field pattern through integrated transparent conductive oxide and metal electrode patterns. This multi-functional design eliminates the need for a separate sealed lens structure
3Device complexity
If conventional LED packages are used, then the structure is simple, but heat dissipation efficiency is poor affecting luminous efficiency and lifespan
Solution Approach 1:
The patent combines the heat dissipation function with the optical control function in a single integrated substrate structure. The substrate with its transparent conductive oxide patterns and metal electrode patterns simultaneously manages thermal energy dissipation and optical field control, achieving efficient heat dissipation without significantly increasing structural complexity
Solution Approach 2:
The substrate is designed as a multi-functional component that performs mechanical support, thermal management, and optical control. This integration allows the package to achieve efficient heat dissipation and optical performance without requiring multiple separate components, maintaining relative structural simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency and optical performance by directly discharging thermal energy and providing optical diffusing or condensing capabilities, improving the luminous efficiency and lifespan of LEDs.
Implementation Method 1
the optical lens may cause secondary optical effects, such as reflection, refraction, and absorption
Implementation Method 2
the optical lens may cause secondary optical effects, such as reflection, refraction, and absorption
Implementation Method 3
the carrier has heat dissipation and optical condensing or optical diffusing functions
Data Source
AI summary
A light-emitting diode (LED) package including a carrier, a pair of conductive wire units, an LED chip, and a control circuit module is provided. The carrier has a carrying portion and a ring frame connected to the periphery of the carrying portion. The carrying portion has a dome-like upper surface and a pair of through holes. The pair of conductive wire units is disposed inside the through holes respectively, and each of the conductive wire units has a conductive wire and an insulating material encapsulating the conductive wire. The LED chip is disposed on the upper surface of the carrier and is electrically connected to the conductive wires. The control circuit module is disposed at a bottom of the carrier and is electrically connected to the conductive wires for controlling the operation of the LED chip.