LED Package Structure With Dual Optical Bodies for Miniaturization
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Solution Overview
Problem
Conventional LED packaging designs with four white walls surrounding an encapsulation limit light emitting efficiency and restrict the overall size of the packaging structure, hindering its application in miniaturized end products.
Innovation Solution
The proposed light emitting device and light source module feature a base with a first substrate and through holes, a conductive unit with separate conductors passing through the substrate, and a package with a first and second package body having different optical properties, allowing for improved light emitting efficiency and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional packaging design with four white walls surrounding an encapsulation is used, then the structural integrity is maintained, but light emitting efficiency is limited and overall size is restricted
Solution Approach 1:
The packaging structure is divided into multiple separate package bodies (first package body, second package body, third package body) instead of a single monolithic structure. Each package body can be independently optimized for different functions, allowing light to pass through selected bodies while blocking others, thereby improving light emitting efficiency without increasing overall size
Solution Approach 2:
The patent transitions from a conventional two-dimensional planar packaging structure to a three-dimensional stacked configuration with multiple package bodies arranged in layers. This vertical stacking allows light to travel through specific transparent package bodies while blocking others, effectively utilizing the third dimension to improve light emitting efficiency without expanding the footprint area
2Volume of stationary object
If the packaging structure size is reduced for miniaturization, then application in miniaturized end products is enabled, but light emitting efficiency may be compromised
Solution Approach 1:
The patent employs a nested configuration where multiple package bodies are stacked vertically in a compact arrangement. The first, second, and third package bodies are positioned in sequence, with each body containing specific functional elements. This nesting allows the structure to maintain a small overall footprint while incorporating multiple light-manipulating layers that improve light emitting efficiency
Solution Approach 2:
Different package bodies are assigned different optical properties (transparent vs. opaque) based on their specific functional requirements. The transparent package bodies allow light to pass through to improve light emitting efficiency, while opaque bodies block light where needed. This localized optimization of optical properties enables efficient light management within a compact structure
Data Source
AI summary
A light emitting device and a light source module are provided. The light emitting device includes a base, a conductive unit, a light unit, and a package. The base includes a first substrate and n through holes, and the through holes pass through the first substrate. The conductive unit includes m conductors that are separate from each other, and the conductors pass through the first substrate. The light unit is electrically connected to the conductors. The package includes a first package body surrounding the light unit and a second package body covering the light unit and the first package body. The first package body and the second package body have different optical properties. Furthermore, m and n are integers greater than or equal to 2, and m is greater than or equal to n.