Wafer-Level LED Package Dual-Side Electrode Extraction
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Solution Overview
Problem
Existing LED package structures face challenges with large volume due to electrodes being extracted from the same side of the silicon substrate, requiring gold wiring and resin sealing, which complicates heat dissipation.
Innovation Solution
A wafer-level package structure where leads are formed on the second side of the substrate to extract electrodes, eliminating the need for gold wiring and allowing for heat dissipation on the second side, reducing package volume and enabling efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrodes are extracted through the same side of the silicon substrate using gold wiring and resin sealing, then electrical connection is achieved, but the package volume increases and heat dissipation becomes difficult
Solution Approach 1:
The patent applies dimensionality change by transitioning from single-sided electrode extraction to dual-sided electrode extraction. The first electrodes are extracted from the first surface of the substrate while the second electrodes are extracted from the second surface, utilizing the third dimension (depth/thickness) of the substrate to reduce the footprint and overall package volume.
Solution Approach 2:
The patent segments the electrode extraction function across two separate surfaces of the substrate. Instead of all electrodes exiting from one side, the structure divides the electrical connection paths, with some electrodes extracted from the first surface and others from the second surface, thereby distributing the electrical connections and reducing the required space on any single side.
2Reliability
If gold wiring and resin sealing are used to extract electrodes, then electrical connection is established, but the package structure becomes complex and volume increases
Solution Approach 1:
The patent extracts the electrode connections directly from the substrate surfaces without requiring intermediate gold wiring. The electrodes are brought out through the substrate edges or surfaces in a simplified manner, eliminating the need for separate wire bonding processes and reducing structural complexity.
3Reliability
If resin sealing is used to seal the light emitting diode, then protection is provided, but heat dissipation becomes difficult
Solution Approach 1:
The patent enables heat dissipation from the second surface of the substrate, providing an additional thermal pathway. By extracting electrodes and enabling thermal management from both surfaces, the structure creates dual pathways for heat removal, reducing thermal buildup without compromising protective sealing.
Data Source
AI summary
A wafer-level package structure of a light emitting diode and a manufacturing method thereof are provided in the present invention. The wafer-level package structure of a light emitting diode includes a die, a first insulating layer, at least two wires, bumps, an annular second insulating layer on the wires and the insulating layer, the annular second insulating layer surrounding an area between the bumps and there being spaces arranged between the second insulating layer and the bumps; a light reflecting cup on the second insulating layer; at least two discrete lead areas and leads in the lead areas. The technical solution of the invention reduces the area required for the substrate; and the electrodes can be extracted in the subsequent structure of the package without gold wiring to thereby further reduce the volume of the package.