Interchangeable LED Package for Edge and Direct Backlight Configurations
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Solution Overview
Problem
Current LED packages are not interchangeable between edge type (side view) and direct type (top view) configurations, limiting their versatility and compatibility in backlight units, which hinders the implementation of local dimming techniques.
Innovation Solution
The development of an LED package with a lead frame design that allows for both top-mounting and side-mounting, featuring a first lead part with a slanted side wall and a second lead part with a flat face, enabling the LED package to be used interchangeably as an edge type or direct type, and a backlight unit that incorporates this LED package for local dimming.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED packages are manufactured according to their intended purposes (edge type or direct type), then their optical performance is optimized, but their compatibility and interchangeability are reduced
Solution Approach 1:
The patent applies universality by designing a single LED package structure that can function in both edge-type and direct-type configurations. The package includes a lead frame with a mounting surface and light-emitting surface arranged to work effectively whether mounted on the side or top of a light guide plate, eliminating the need for separate specialized packages for each application type.
Solution Approach 2:
The patent utilizes dimensional arrangement by positioning the light-emitting surface and mounting surface in specific spatial relationships within the package. The lead frame structure extends in multiple dimensions with the light-emitting surface oriented perpendicular to the mounting surface, allowing the same package to adapt to different mounting orientations (side or top) by changing the installation angle rather than requiring different package designs.
2Reliability
If separate LED packages are designed for edge type and direct type configurations, then their respective functions are optimized, but device complexity increases
Solution Approach 1:
The patent reduces device complexity by consolidating multiple specialized packages into a single universal package design. The lead frame structure with its specific geometric arrangement of mounting and light-emitting surfaces can serve both edge-type and direct-type backlight configurations, reducing inventory requirements and simplifying manufacturing processes while maintaining functional optimization for both applications.
3Manufacturing precision
If LED packages are designed for specific mounting orientations, then manufacturing precision is improved, but adaptability to different configurations is reduced
Solution Approach 1:
The patent achieves both manufacturing precision and configuration flexibility through its three-dimensional lead frame design. The package maintains precise geometric relationships between the mounting surface and light-emitting surface that ensure proper alignment and optical performance, while the overall package orientation can be adjusted during installation to accommodate either side-view or top-view mounting requirements without compromising manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the LED package to be used in both configurations, enhancing versatility and allowing for local dimming capabilities, thereby improving the flexibility and performance of backlight units.
Implementation Method 1
an LED chip (11) mounted on the lead frame (20) and emitting light
Data Source
Figure 1~2
Figure 3~4
Figure 5A~5B
AI summary
A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.