LED Package Lead Electrode Depression for Resin Burr Reduction
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Solution Overview
Problem
The formation of resin burrs during the manufacturing of LED packages can lead to mounting failures due to the viscosity of the resin material and the molding process, which increases the complexity and workload of removing these burrs.
Innovation Solution
A package design with a first lead electrode having a depression in its lower surface, which reduces the thickness of a portion to receive the resin material, increasing upward pressure and minimizing resin burrs, combined with a method of injection molding where the lead electrodes are positioned to direct the resin flow effectively, reducing the occurrence of burrs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If resin material is injected into the mold cavity during package manufacturing, then the package structure is formed, but resin burrs occur due to resin viscosity and molding process
Solution Approach 1:
The first lead electrode is designed with non-uniform thickness, featuring a thinner second region and a thicker first region. This local variation in thickness creates a depression that strategically receives excess resin material, preventing it from forming burrs on the package surface while maintaining structural integrity in other areas.
Solution Approach 2:
The depression is pre-formed in the first lead electrode before the injection molding process. This preliminary structural preparation provides a designated receptacle for the resin material, guiding the resin flow and pressure distribution during molding to prevent burr formation before it occurs.
2Manufacturing precision
If resin burrs are formed during package manufacturing, then the package structure is completed, but mounting of LED element fails
Solution Approach 1:
By creating a localized depression in the first lead electrode, the design concentrates the resin reception area in a specific region. This ensures that excess resin is captured where it will not interfere with the LED element mounting surface, thereby maintaining mounting reliability while still accommodating the resin material.
Solution Approach 2:
The invention converts the potentially harmful effect of excess resin material (which causes burrs and mounting failures) into a beneficial feature by designing the depression to deliberately receive and contain the resin. The resin, instead of forming unwanted burrs, is channeled into a functional depression that prevents mounting issues.
3Productivity
If resin burrs occur during package manufacturing, then the molding process is completed, but additional work is required to remove the burrs
Solution Approach 1:
The depression is pre-formed in the first lead electrode before injection molding, creating a built-in receptacle for excess resin. This preliminary preparation eliminates the need for subsequent burr removal operations, as the resin is captured during the molding process itself, thereby simplifying the manufacturing process and improving ease of manufacture.
Solution Approach 2:
The invention extracts the problematic burr formation from the manufacturing process by providing a dedicated depression that captures excess resin during molding. This removes the harmful byproduct (burr) at the source, eliminating the need for additional removal operations and streamlining the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the occurrence of resin burrs, simplifying the manufacturing process and improving the reliability of LED package assembly by ensuring better contact between the lead electrodes and the mold, thereby enhancing the efficiency and accuracy of the packaging process.
Implementation Method 1
injecting a resin material for forming the resin molded body into the cavity from a lower side of the lower mold, and curing or hardening the resin material to form the resin molded body
Data Source
AI summary
A package includes a first lead electrode, a second lead electrode, and a resin molded body. The first lead electrode has a first upper surface and a first lower surface defining a depression and opposite to the first upper surface. The second lead electrode has a second upper surface and a second lower surface opposite to the second upper surface. The resin molded body defining a recess with a bottom surface including the first upper surface and the second upper surface, the resin molded body also covering the first lower surface and the second lower surface. The first electrode having a first region closer to the second lead electrode and a second region farther to the second lead electrode than the first region, and having a thickness smaller than a thickness of the first region due to the depression defined in the first lower surface.