LED Package With Universal Electrode Extensions
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Solution Overview
Problem
Conventional LED packages require redesigning of circuit connections and space arrangements when the position of the LED chip needs to be changed, limiting their flexibility and efficiency in light emission.
Innovation Solution
The LED package design features a reflecting cup with a receiving groove that houses the LED chip and electrically connects two elongated electrodes, allowing for flexible mounting of the LED chip and efficient light emission, with the option of using a reflecting film and fluorescent materials to enhance light output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the LED chip position is changed to emit light laterally, then light emission direction is improved, but circuit connection and space arrangement complexity increases
Solution Approach 1:
The substrate is designed with universal electrode extensions that can accommodate both top-view and side-view LED chip mounting configurations. The electrode structure serves multiple functions: electrical connection, mechanical support, and spatial arrangement, eliminating the need for separate circuit board designs for different emission directions.
Solution Approach 2:
The substrate is segmented into distinct functional regions: LED chip mounting area with electrode extensions, light emission area, and electrode connection areas. This segmentation allows independent optimization of each region and simplifies the overall circuit design by clearly defining electrical connection paths.
2Ease of operation
If the LED chip is mounted on the side of the package, then lateral light emission is achieved, but manufacturing complexity increases
Solution Approach 1:
The substrate is pre-formed with electrode extensions and mounting structure configurations that accommodate side-view LED chip mounting. This preliminary structuring eliminates the need for complex post-assembly circuit board modifications or reconfiguration, significantly simplifying the manufacturing process.
3Illumination intensity
If conventional LED package design is used, then top-view light emission is achieved, but flexibility in positioning is limited
Solution Approach 1:
The substrate design provides universal mounting capability for both top-view and side-view LED chip configurations. The electrode extensions and mounting structure can accommodate different LED chip positions and orientations, giving manufacturers flexibility in selecting the optimal light emission direction for different application requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables flexible positioning of the LED chip without requiring significant redesign of the circuit or space arrangement, improving light emission efficiency and allowing for easy integration of reflective and fluorescent materials to enhance output.
Implementation Method 1
a reflector mounted on the top surface of the substrate and enclosing the LED chip therein
Implementation Method 2
with the option of using a reflecting film and fluorescent materials to enhance light output
Data Source
AI summary
An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has a first connecting face away from the first main portion. The second electrode includes a second main portion and a second connecting portion extending outwardly from the second main portion. The second connecting portion has a second connecting face away from the second main portion. The first main portion and the second main portion are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup.