Light-emitting Device Package Electrode Separation Line
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Solution Overview
Problem
Conventional flip-bonding type light-emitting device packages face damage due to excessive vertical force applied through the bump-shaped conductive adhesive, which can cause structural damage to the light-emitting structure.
Innovation Solution
The introduction of an electrode separation line with at least two bent portions between the first and second lead frames, which reduces the physical force applied to the light-emitting device by providing strong coupling with the lead frames and stabilizing their position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bump-shaped conductive adhesive is used to electrically connect the lead frames to the light-emitting device, then electrical connection is achieved, but excessive vertical force is transmitted to the light-emitting structure causing damage
Solution Approach 1:
The electrode separation line acts as an intermediary element between the lead frames and the light-emitting device. It provides electrical connection while mechanically isolating the light-emitting structure from excessive vertical force, thus resolving the contradiction between achieving reliable electrical connection and preventing structural damage
Solution Approach 2:
The electrode separation line divides the electrode region into separate zones, creating distinct functional areas for electrical connection and mechanical support. This segmentation allows the system to independently optimize for both electrical reliability and mechanical protection
2Manufacturing precision
If the lead frames are rigidly fixed to ensure stable position, then positioning accuracy is improved, but the mobility reduction causes excessive force transmission to the light-emitting device
Solution Approach 1:
The electrode separation line changes the mechanical parameters of the lead frame assembly by introducing a compliant element. This allows the system to maintain positioning accuracy while reducing the transmission of excessive force to the light-emitting device through controlled mechanical compliance
Data Source
AI summary
An embodiment provides a light emitting device package comprising: a package body; a first lead frame and a second lead frame, of which at least a part of each is inserted into the package body; and a light emitting device electrically flip bonded to the first lead frame and to the second lead frame, wherein the package body forms an electrode separation line between the first lead frame and the second lead frame, and the electrode separation line has at least two curved portions.