LED Package Structure With Encapsulant Interlock for Humidity Reliability

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing electronic device package structures, particularly those using light-emitting diodes (LEDs), face issues with short service life due to the encapsulant detaching from the LED over time, especially under high temperature and high humidity conditions.

Innovation Solution

A package structure that includes a lead frame with an engaging protrusion and a fluorescent encapsulant, which enhances the strength of the connection between the LED and the encapsulant, thereby improving the service life of the electronic device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the encapsulant is directly mounted on the LED without additional structural features, then the device structure remains simple, but the encapsulant detaches after long-term use under high temperature and humidity conditions

Engineering Contradiction:

Improveconnection strength between encapsulant and LEDVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The lead frame is divided into multiple functional regions: a mounting region for the LED and a peripheral engaging protrusion region for the encapsulant. This segmentation allows the encapsulant to be mechanically interlocked with the lead frame through the engaging protrusions, preventing detachment while maintaining structural simplicity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The engaging protrusions extend from the peripheral surface of the lead frame into the encapsulant, adding a vertical dimension to the connection interface. This dimensional extension creates mechanical interlocking that prevents the encapsulant from detaching under thermal stress and humidity conditions

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Duration of action of stationary object

If the encapsulant is securely connected to prevent detachment, then the service life is extended, but the manufacturing process becomes more complex

Engineering Contradiction:

Improveservice life of electronic deviceVSAvoidmanufacturing ease of package structure

Core Design Contradiction:

Duration of action of stationary objectVSEase of manufacture

Solution Approach 1:

The engaging protrusions are integrated into the lead frame structure during the molding process, combining the lead frame and encapsulant retention features into a single unified component. This merging allows the encapsulant to be securely connected without requiring additional separate fastening components or complex assembly steps

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The engaging protrusions are designed to automatically engage with the encapsulant material during the molding process, creating a self-retaining structure that secures the encapsulant without requiring additional fastening operations or complex manufacturing steps

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS20250098384A1Package structure

Publication Date: 2025.03.20 ENNOSTAR CORP

AI summary

A package structure is provided. The package structure includes a lead frame, a first connecting piece, a light-emitting diode, an engaging protrusion, and a fluorescent encapsulant. The lead frame has an upper surface, a lower surface, and a side surface between the upper surface and the lower surface. The first connecting piece is disposed at the center of the upper surface. The light-emitting diode is disposed on the first connecting piece. The engaging protrusion is disposed on the periphery of the upper surface. The fluorescent encapsulant is disposed on the upper surface and covers the light-emitting diode and the engaging protrusion.