Light Emitting Device Package with Exposed Metal Core Cavity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light emitting device packages face challenges in heat dissipation, leading to reduced performance and lifespan, especially in high-temperature applications like general illumination and LCD backlights, where efficient heat discharge is crucial to maintain optimal operation.
Innovation Solution
A light emitting device package is designed with a metal core having a cavity exposed by removing parts of the insulating and metal layers, allowing direct mounting of the light emitting device on the metal core for enhanced heat dissipation, and additional cavities and conductive layers are used for improved electrical connectivity and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional light emitting device packages are used with insulating and metal layers covering the metal core, then electrical insulation is provided, but heat dissipation performance deteriorates
Solution Approach 1:
The package structure is segmented into distinct functional zones: a first cavity region where the light emitting device contacts the metal core for heat dissipation, and a second cavity region with conductive layers for electrical connection. This segmentation allows simultaneous achievement of thermal management and electrical insulation in different spatial locations.
Solution Approach 2:
Different regions of the package are assigned different material properties and functions: the first cavity region prioritizes thermal conductivity by exposing the metal core, while the second cavity region prioritizes electrical conductivity through conductive layers. This local differentiation resolves the contradiction between heat dissipation and electrical insulation requirements.
2Temperature
If insulating layer and metal layer are removed to expose metal core for direct mounting, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The metal core is pre-formed with the cavity structure and insulating layers are selectively removed in advance to create the first and second cavity regions. This preliminary preparation simplifies the subsequent mounting process by providing pre-configured thermal and electrical connection zones, reducing overall manufacturing complexity despite the additional initial processing steps.
3Reliability
If additional cavities and conductive layers are added for electrical connectivity, then electrical connection is improved, but device structure complexity increases
Solution Approach 1:
The package structure merges thermal management and electrical connection functions into a unified design. The second cavity region with conductive layers serves dual purposes: providing electrical connectivity while also contributing to the overall structural framework. This merging reduces the need for separate components and simplifies the overall package structure despite the added functionality.
Solution Approach 2:
The conductive layers in the second cavity region perform multiple functions: establishing electrical connections, providing structural support, and facilitating heat distribution. This multi-functionality reduces the number of separate components needed, thereby reducing overall device structure complexity while improving electrical connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation capabilities, simplifies the package structure and manufacturing process, and reduces costs, making it suitable for high-heat generating devices while maintaining optimal operation temperatures.
Implementation Method 1
a light emitting device package for applying power to a light emitting device through a metal core by forming a cavity to expose a top surface of the metal core... capable of being applicable to a high heat generating device by improving a heat discharging performance
Implementation Method 2
an insulating layer formed on the metal core; a metal layer formed on the insulating layer
Data Source
AI summary
The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.