LED Package Fluorescent Coating and Wire Bonding
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Solution Overview
Problem
Conventional LED packages face reduced luminous efficiency due to the fluorescent material being coated only on the surface of the LED chip, and the mixture of silicon and fluorescent material often exposing outside the package mold, leading to package failures and poor workability during manufacturing.
Innovation Solution
A light emitting diode package design where the fluorescent material is coated on the upper part of the LED chip, and a reflection material is included in a transparent encapsulant on the lower part to reflect and emit light, while wires are bonded to the bottom surface of the LED chip to prevent direct contact with the fluorescent material, improving luminous efficiency and reducing package failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the fluorescent material is coated only on the surface of the LED chip, then the manufacturing process is simple, but the luminous efficiency is reduced
Solution Approach 1:
The patent extends the fluorescent material coating from the traditional 2D chip surface to the 3D external surfaces including side surfaces and top surface of the LED chip. This dimensional extension ensures that light emitted from all directions of the chip can be converted to white light, significantly improving luminous efficiency while maintaining manufacturing feasibility through conventional coating methods
Solution Approach 2:
The patent divides the coating process into multiple stages or regions, first coating the side surfaces and then the top surface, allowing each surface to be optimized for its specific light emission characteristics. This segmented approach ensures comprehensive light conversion across all chip surfaces
2Productivity
If the mixture of silicon and fluorescent material is injected inside the package mold, then the LED chip can be fixed and sealed simultaneously, but the fluorescent material is exposed outside through the wire causing package failure
Solution Approach 1:
The patent extracts the fluorescent material coating process from the mold injection process. Instead of mixing fluorescent material with silicon and injecting together, the fluorescent material is pre-coated on the LED chip before mounting. This separation eliminates the problem of fluorescent material exposure through wires during injection while maintaining the efficiency of simultaneous fixing and sealing
Solution Approach 2:
The fluorescent material coating is performed as a preliminary action before the LED chip is mounted in the package mold. By pre-coating the chip with fluorescent material on its external surfaces, the subsequent mold injection process can proceed without risk of fluorescent material exposure, ensuring package reliability while maintaining manufacturing efficiency
3Ease of manufacture
If the wire is positioned at an upper part of the LED chip for electrical connection, then the connection is straightforward, but the molding material can only be filled by dispensing method deteriorating workability
Solution Approach 1:
The patent changes the spatial arrangement by positioning the wire at the bottom surface of the LED chip instead of the upper surface. This dimensional repositioning allows the molding material to be injected from the bottom of the package mold, enabling complete filling without requiring complex dispensing methods and significantly improving workability
4Loss of energy
If the fluorescent material is coated on the external surface of the LED chip, then the luminous efficiency is improved, but the fluorescent material may contact the wire causing package failure
Solution Approach 1:
The patent extracts the wire from the upper surface where it would contact the fluorescent material and repositions it to the bottom surface of the LED chip. This spatial separation ensures that the fluorescent material coated on the external surfaces cannot contact the wire, eliminating the cause of package failure while preserving the luminous efficiency benefits of external surface coating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances luminous efficiency by ensuring the fluorescent material is in contact with the LED chip's surface and prevents package failures by avoiding exposure of the fluorescent material through the wires, while simplifying the manufacturing process and reducing costs.
Implementation Method 1
an encapsulant coated at a lower part of the substrate... including a reflection material in the transparent resin and can be emitted through the fluorescent material of the upper part
Implementation Method 2
a molding material coated at the upper part of the substrate including an external surface of the LED chip... fluorescent material for white light-emitting
Data Source
AI summary
The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.