LED Package Frame with Inserted Lead and Insulating Layer
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Solution Overview
Problem
Conventional high power LED packages require a separate heat conductive part and lead portions, leading to increased size due to resin molding, which compromises heat dissipation efficiency and stability.
Innovation Solution
An LED package frame design where a lead is inserted into a heat conductive member with an L-shaped receiving part and an insulating layer to prevent direct contact, allowing for reduced size while maintaining high heat conductivity and stability, and enabling mass production without the need for jigs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate heat conductive part and lead portions are used in conventional high power LED packages, then heat dissipation performance is maintained, but package size increases due to resin molding requirements
Solution Approach 1:
The patent merges the heat conductive member and lead portions into a single integrated structure. The lead portions are inserted into receiving parts formed in the heat conductive member, eliminating the need for separate resin molding to join these components. This integration maintains effective heat dissipation pathways while reducing the overall package volume by removing redundant structural elements and molding material.
Solution Approach 2:
The lead portions are nested within receiving parts of the heat conductive member. This nesting arrangement allows the lead portions to be housed inside the heat conductive structure rather than being positioned externally, thereby reducing the external dimensions of the package while maintaining functional separation through the insulating layer.
2Ease of manufacture
If lead portions are directly connected to heat conductive part in conventional designs, then assembly is simplified, but short-circuit issues occur between lead and heat conductive part
Solution Approach 1:
An insulating layer is introduced as an intermediary between the lead portions and the heat conductive member. This thin insulating layer prevents direct electrical contact and potential short-circuits while allowing the lead portions to remain positioned within the receiving parts of the heat conductive member. The insulating layer maintains the electrical isolation function without compromising the mechanical integration or heat dissipation effectiveness.
3Stability of the object's composition
If conventional resin molding is used to join heat conductive part and lead portions, then structural stability is achieved, but manufacturing complexity increases due to jig requirements
Solution Approach 1:
The patent segments the manufacturing process into distinct steps: first forming the heat conductive member with integrated receiving parts, then separately inserting the lead portions into these receiving parts. This segmentation eliminates the need for complex jig-based resin molding operations, as the receiving parts provide inherent mechanical guidance and positioning. The structural stability is maintained through the precise fit of the lead portions within the receiving parts and the insulating layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the overall size of the LED package while ensuring high heat conductivity and stability, allowing for efficient heat dissipation and enabling mass production without short-circuit issues.
Implementation Method 1
a heat conductive member made of a lump of high heat conductivity material
Implementation Method 2
an electrically insulating layer placed in tight contact between the lead and the receiving part of the heat conductive member to separate the lead from the receiving part
Data Source
AI summary
An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.