LED Package Housing Grooves for Stable Substrate Solder Coupling
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Solution Overview
Problem
Conventional side-view light emitting diode packages face challenges in achieving tight coupling with exterior substrates due to the thickness of the solder connections, which impedes efficient electrical connection and stability.
Innovation Solution
The design incorporates a housing with grooves on its lower surface, where pads are located, allowing for solder to fill these grooves, enhancing the coupling with the exterior substrate by increasing the contact area and minimizing the distance between adjacent diode chips, while maintaining electrical insulation and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder connections are used to connect the light emitting diode package to the exterior substrate, then electrical connection is achieved, but the thickness of the solder connections impedes tight coupling and stability
Solution Approach 1:
The housing lower surface is designed with grooves that extend in the vertical direction, allowing solder to fill these grooves and create mechanical interlocking. This dimensional change from a flat surface to a grooved structure enables tighter coupling without increasing solder thickness horizontally.
Solution Approach 2:
The housing lower surface has different local properties: flat regions for electrical insulation and grooved regions for electrical connection. This local differentiation allows the housing to simultaneously provide insulation where needed and conductive pathways where required, resolving the contradiction between stability and connection quality.
2Reliability
If the housing lower surface is made entirely conductive to improve electrical connection, then electrical conductivity increases, but electrical insulation between adjacent diode chips is compromised
Solution Approach 1:
The housing lower surface is designed with spatially differentiated properties: grooved regions provide conductive pathways for electrical connection, while flat regions maintain electrical insulation. This local quality differentiation allows simultaneous achievement of good electrical connection and prevention of short circuits between adjacent diode chips.
Solution Approach 2:
The housing lower surface is segmented into multiple functional regions: insulating flat areas and conductive grooved areas. This segmentation allows the housing to perform multiple electrical functions simultaneously, resolving the contradiction between connection quality and insulation requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a more secure and stable connection of the light emitting diode package to the exterior substrate, reducing the risk of short circuits and improving thermal management through enhanced solder adhesion and electrical conductivity.
Implementation Method 1
a reflective layer disposed on a side surface of the light emitting structure of the light emitting element and configured to reflect light emitted through the side surface of the light emitting structure
Implementation Method 2
an encapsulation portion disposed above a third surface of the plurality of light emitting elements... the encapsulation portion and the surface barrier form a dual structure for blocking penetration of moisture and dust to the plurality of light emitting elements
Implementation Method 3
the surface barrier includes a smoother surface than a surface of a light emitting element of the plurality of light emitting elements such that a material for the encapsulation portion flows along the surface of the surface barrier
Implementation Method 4
a housing with grooves on its lower surface, where pads are located, allowing for solder to fill these grooves, enhancing the coupling with the exterior substrate by increasing the contact area
Implementation Method 5
The reflective layer is formed of a material having high thermal conductivity and reflectivity
Data Source
AI summary
A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.