LED Package Layer Grooves for Uniform White Light

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Solution Overview

Problem

The irregular shape of the package layer in light-emitting diodes leads to non-uniform optic paths, resulting in non-uniform white light emission due to varying thicknesses in different portions.

Innovation Solution

A light-emitting diode design with electrode pads and a circuit layer spaced to form grooves, allowing a uniform dome-shaped package layer filled with phosphor powder, ensuring identical optic paths for uniform white light emission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the package layer is coated with phosphor powders to emit white light, then the LED can achieve white light emission, but the irregular shape of the package layer causes non-uniform optic paths and non-uniform white light emission

Engineering Contradiction:
Improvewhite light emission uniformityVSAvoidpackage layer shape regularity
Core Design Contradiction:
Illumination intensityVSShape

Solution Approach 1:

The invention performs preliminary action by forming grooves in the substrate before coating the package layer with phosphor powders. These pre-formed grooves guide the package material to fill uniformly, ensuring a regular dome shape and uniform optic path length before the actual light emission function is implemented.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention changes the geometric parameters of the package layer by controlling its thickness through groove formation. By setting specific groove dimensions (depth, width, spacing), the package layer thickness is standardized, transforming the irregular shape into a uniform dome shape with consistent optic path length, thereby improving white light emission uniformity.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the package layer thickness varies in different portions, then the optic paths become non-uniform, but making the thickness uniform requires additional structural constraints

Engineering Contradiction:
Improvepackage layer thickness uniformityVSAvoidstructural complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention segments the substrate surface into multiple groove regions before package layer coating. By dividing the surface into controlled segments (grooves with specific dimensions and spacing), the package material is guided to form uniform thickness in each segment, achieving overall thickness uniformity without requiring complex post-processing or additional structural components.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The uniform dome-shaped package layer ensures consistent light transmission, achieving uniform white light emission by reducing the spreadability of the package material and standardizing the optic path length.

Implementation Method 1

When a blue light chip of the LED emits blue light, the red and green phosphors of the package layer are excited by the blue light to respectively emit red light and green light. The red and green light so generated are mixed with the blue light transmitting through the package layer to thereby form white light.

Methodology Applied
Scientific EffectPhotoluminescence: Photoluminescence

Data Source

PatentUS9780272B2Light-emitting diode and method for manufacturing light-emitting diode
Publication Date: 2017.10.03 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US9780272B2 patent drawing
  • US9780272B2 patent drawing
  • US9780272B2 patent drawing

AI summary

Disclosed are a light-emitting diode and a method for manufacturing a light-emitting diode. The method includes: a base layer; a circuit layer formed on the base layer; a light-emitting chip formed on the circuit layer; electrode pads formed on the base layer and electrically connected to the light-emitting chip so that the electrode pads and the circuit layer and the light-emitting chip are spaced from each other by first spacing distances and the electrode pads and the circuit layer and the light-emitting chip define therebetween first grooves, where an altitude of the electrode pad is equal to an altitude of the light-emitting chip; and a phosphor powder contained package layer formed on the light-emitting chip and the electrode pads and filled into the first grooves between the electrode pads and the circuit layer to form a uniform dome shape.