LED Package Heat Conduction Paths in Backlight Modules
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Solution Overview
Problem
Conventional light source devices for backlight modules have limited heat dissipation mechanisms, which hinder the effective removal of heat generated by light-emitting diodes (LEDs).
Innovation Solution
The design incorporates a back frame unit with a thermal conductive base plate and a casing part, along with an LED package structure featuring a lead frame unit that forms multiple heat-conducting paths between the base plate and a spaced-apart first plate, enhancing heat dissipation through exposed lead frames and thermal pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the LED is soldered to the circuit board with only one side contact and uses a single thermal conductive material layer, then the device structure is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The thermal management system is segmented into multiple independent thermal conduction paths: a first thermal conductive material layer between the circuit board and first plate, and a second thermal conductive material layer between the circuit board and base plate. This segmentation allows heat to be dissipated through multiple parallel pathways, improving heat dissipation efficiency while maintaining reasonable structural complexity
Solution Approach 2:
The invention transitions from a single-plane heat dissipation structure to a three-dimensional multi-layer thermal conduction architecture. By stacking thermal conductive material layers and creating multiple plates at different heights, heat can flow in multiple spatial dimensions simultaneously, significantly enhancing heat dissipation capacity
2Temperature
If a single heat conduction path is used through the circuit board and thermal conductive material, then the device structure is simple, but the heat dissipation capacity is limited
Solution Approach 1:
The heat conduction path is divided into multiple segmented pathways: one path through the first thermal conductive material layer to the first plate, and another path through the second thermal conductive material layer to the base plate. Each segment independently conducts heat, and their combined capacity exceeds that of a single path, effectively increasing overall heat dissipation capacity
Solution Approach 2:
Multiple heat conduction paths are merged into a unified thermal management system where the circuit board, first plate, and base plate work together as an integrated heat dissipation network. The parallel combination of multiple thermal conduction pathways increases the total heat transfer capacity while maintaining system coherence
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation by creating multiple heat paths, reducing junction temperature and preventing light obstruction, thus enhancing the thermal management of LEDs in backlight modules.
Implementation Method 1
heat generated by the light-emitting diode 93 is dissipated via heat conduction through the circuit board 92, the thermal conductive material 94, and the thermal conductive frame 91
Data Source
AI summary
A light source device of a backlight module includes a back frame unit and a light-emitting diode (LED) package structure. The back frame unit includes a thermal conductive base plate, and a casing part having a first plate spaced apart from and parallel to the base plate. The LED package structure is disposed between the base and first plates, and includes a package body having a light-emitting surface, and two lateral surfaces respectively facing the base plate and the first plate. A lead frame unit includes a lead frame partially exposed from the lateral surfaces of the package body to form first and second heat-conducting paths with the base and first plates, respectively.