LED Package Reflective Coating Structure for Slim Heat Dissipation
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Solution Overview
Problem
Existing LED packages using metal core printed circuit boards (MCPCBs) face issues with thickness, flexibility, and inadequate heat dissipation due to a thick lower metal layer, leading to increased defect rates and difficulty in handling, as well as obstruction of slim package formation and inefficient heat release.
Innovation Solution
A surface-mounting type LED package is developed using a thin metal plate with an insulating layer, a lead frame, and a reflective coating layer, where the LED chip is directly mounted on the metal plate, allowing for effective heat dissipation and a slim package design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thick lower metal layer is used in MCPCB, then structural strength is improved, but package thickness increases and heat dissipation efficiency deteriorates
Solution Approach 1:
The patent changes the thickness parameter of the lower metal layer from thick (related art) to thin (present invention), achieving both slim package design and improved heat dissipation while maintaining structural strength through optimized material selection and structural design
2Strength
If a thick lower metal layer is used in MCPCB, then structural strength is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent optimizes the thickness parameter of the lower metal layer, changing it from thick to thin configuration. This parameter change improves heat dissipation efficiency by reducing thermal resistance while maintaining adequate structural strength through material and structural optimization
Solution Approach 2:
The patent enhances heat dissipation by introducing additional heat dissipation pathways and structures, moving beyond relying solely on the thickness of the lower metal layer, thereby improving thermal management in multiple dimensions
3Stability of the object's composition
If a thick MCPCB is used, then structural stability is improved, but handling convenience deteriorates and defect rate increases
Solution Approach 1:
The patent changes the thickness parameter of the MCPCB from thick to thin, improving handling convenience and reducing defect rates during assembly while maintaining structural stability through optimized material selection and structural design
4Reliability
If LED chip is not directly contacted with metal plate, then insulation is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent introduces a thermal conductive adhesive as an intermediary substance between the LED chip and metal plate. This intermediary enables both thermal conduction for efficient heat dissipation and electrical insulation for reliability, simultaneously addressing both requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a significantly reduced package thickness, enabling efficient heat release and meeting the demand for a slim package design while minimizing defect rates and improving handling convenience.
Implementation Method 1
a reflective coating layer on the lead frame
Implementation Method 2
a molding material molding the light-emitting diode chip in a predetermined shape
Data Source
AI summary
Provided is a package of a light emitting diode. The package according to an embodiment includes a package of a light emitting diode, the package comprising: a base layer including an entire top surface that is substantially flat; a light emitting diode chip on the base layer; a lead frame electrically connected to the light emitting diode chip; and a reflective coating layer comprising titanium oxide, wherein a top surface of the reflective coating layer is substantially parallel to a top surface of the base layer, and wherein ends of the reflective coating layer and base layer are aligned with each other.