LED Package Heat Radiation Frame and Fluorescent Sealant
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Solution Overview
Problem
Ceramic LED packages for backlight units face challenges due to narrow light radiation angles, chromatic variation issues, and high manufacturing costs, making them unsuitable for larger LCD displays.
Innovation Solution
A light emission device package with a substrate, heat radiation frame, and a sealant member containing fluorescent particles, which minimizes chromatic deviations and expands light radiation angles by forming a uniform fluorescent layer, reducing the need for a ceramic reflection plate and thus lowering production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a ceramic LED package is used, then thermal characteristics are improved, but manufacturing cost increases and chromatic uniformity deteriorates
Solution Approach 1:
The patent replaces expensive ceramic packages with inexpensive metal packages that can be mass-produced using standard manufacturing processes. The metal package achieves sufficient thermal management without requiring costly ceramic materials, directly addressing the manufacturing cost issue while maintaining thermal performance.
Solution Approach 2:
The patent modifies the package structure by adding a reflective plate with specific reflectivity characteristics and adjusting the phosphor coating parameters. These parameter changes enable the metal package to achieve chromatic uniformity comparable to or better than ceramic packages, while maintaining thermal performance through optimized heat dissipation pathways.
2Temperature
If a ceramic LED package is used, then thermal characteristics are improved, but chromatic uniformity deteriorates
Solution Approach 1:
The patent introduces a reflective plate as an intermediary element between the LED chip and the external environment. This reflective plate with optimized reflectivity characteristics (0.8-0.95) acts as a mediator to redistribute light uniformly in all directions, eliminating the chromatic variation issues inherent in conventional ceramic packages while maintaining effective thermal management.
Solution Approach 2:
The patent applies phosphor coating with specific characteristics to specific regions of the package structure, particularly on the reflective plate. This localized quality enhancement ensures uniform light emission characteristics in critical areas while maintaining thermal performance through the overall package design, achieving chromatic uniformity without requiring expensive ceramic materials.
3Illumination intensity
If the LED package is positioned apart from optical sheets, then light radiation angle is improved, but backlight unit thickness increases
Solution Approach 1:
The patent transitions from a conventional linear arrangement where the LED package is positioned apart from optical sheets to a three-dimensional integrated structure. The reflective plate and phosphor coating create omnidirectional light emission in the vertical dimension, allowing the LED package to be positioned closer to optical sheets while maintaining wide light radiation angles, thereby reducing overall backlight unit thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a thinner, more cost-effective LED package with improved chromatic uniformity and wider light radiation, suitable for direct type backlight units, reducing manufacturing costs and enhancing light emission efficiency.
Implementation Method 1
a sealant member (400) on the LED chip (300), wherein the sealant member (400) includes fluorescent particles
Data Source
AI summary
A light emission device package including a substrate, an opening portion on the substrate, a heat radiation frame on the opening portion, the heat radiation frame protruding from the substrate, a light emission device chip on the heat radiation frame, and a sealant member on the light emission device chip.