LED Package Heat Sink Frame for Thermal Management
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Solution Overview
Problem
Light emitting diodes (LEDs) face challenges in effectively dissipating heat, which can lead to damage and discoloration, reducing their reliability and efficiency in applications such as display devices and lighting systems.
Innovation Solution
The design incorporates a light emitting device package with a package body, lead frames, and a heat sink frame that serves as both a heat dissipation mechanism and a reflective layer, utilizing metallic materials and an encapsulant layer with fluorescence materials to enhance heat transfer and light reflection, allowing for direct heat dissipation to a thermally conductive lower cover or support member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional LED packaging without integrated heat sink is used, then device complexity is reduced, but heat dissipation efficiency deteriorates leading to damage and discoloration
Solution Approach 1:
The patent combines the heat sink frame and reflective layer into a single integrated component. The heat sink frame serves dual functions: dissipating heat from the LED and reflecting light. This merging of functions reduces the number of separate components needed while improving both heat dissipation efficiency and device reliability.
Solution Approach 2:
The heat sink frame is designed to perform multiple functions simultaneously: it acts as a thermal management component to conduct heat away from the LED, and as an optical component to reflect and redirect light. This multi-functionality reduces overall device complexity while maintaining or improving performance.
2Temperature
If heat dissipation structure is added to LED package, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The heat sink is integrated with the reflective layer to form a single component rather than separate parts. This merging reduces the number of assembly steps and components while achieving effective heat dissipation through the heat sink frame that contacts the LED substrate.
Solution Approach 2:
The heat sink frame serves dual purposes: thermal management by conducting heat away from the LED, and optical management by reflecting light. This multi-functionality means one component accomplishes what would otherwise require multiple separate components, reducing overall complexity.
3Temperature
If metallic heat sink frame is integrated with package body, then thermal resistance is reduced, but manufacturing complexity increases
Solution Approach 1:
The heat sink frame is formed as an integrated part of the package body through injection molding, eliminating the need for separate assembly steps. The metallic heat sink frame is incorporated during the molding process itself, reducing manufacturing complexity despite the complexity of the thermal management function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency, minimizes damage and discoloration, and enhances the reliability of light emitting modules and systems by reducing thermal resistance and effectively managing heat generated by the LEDs.
Implementation Method 1
a heat sink frame which serves as a heat dissipation mechanism... allowing for direct heat dissipation to a thermally conductive lower cover or support member
Implementation Method 2
a heat sink frame which serves as both a heat dissipation mechanism and a reflective layer... enhancing heat transfer and light reflection
Implementation Method 3
an encapsulant layer with fluorescence materials to enhance heat transfer and light reflection
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
Disclosed are a light emitting device package (100) and a light emitting apparatus. The light emitting device package (100) comprises a package body (10) having a cavity (70), first and second frames (21,22) passing through the package body (10) and exposed in the cavity (70), a third frame (23) disposed on a bottom surface of the cavity (70) and electrically insulated from the first and second frames (21,22), a light emitting device (31,32) on the third frame (23), and a wire (51,53) electrically connecting the first and second frames (21,22) with the light emitting device (31,32). A top surface of the third frame (23) comprises a first plane having a first height, a second plane having a second height lower than the first height, and an inclined surface connecting the first plane with the second plane. The inclined surface is exposed in the cavity.