LED Package Heat Sink Integration for Thermal Management
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Solution Overview
Problem
Conventional backlight units for LCDs face challenges in achieving a compact design while maintaining effective heat dissipation and efficient light incidence, leading to reduced lifespan and light efficiency of light emitting diode (LED) chips.
Innovation Solution
A light emitting diode package is designed with a heat sink integrated into the body, where the heat sink serves both as a heat radiator and an external lead terminal, allowing for efficient heat dissipation and simultaneous packaging of multiple LED chips without protruding lead terminals, enhancing thermal management and light incidence efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional LED packages with separate lead terminals and heat sinks are used, then heat dissipation can be achieved, but the package size increases and light incidence efficiency decreases
Solution Approach 1:
The patent combines the lead terminal and heat sink into a single integrated component. The lead frame serves dual functions: providing electrical connection and acting as a heat dissipation structure. This merging eliminates the need for separate heat sink components, reducing overall package volume while maintaining effective thermal management through the lead frame's extended surface area.
Solution Approach 2:
The lead frame is designed to perform multiple functions simultaneously: it provides electrical connectivity to the LED chip, serves as a mechanical support structure, and functions as a heat sink for thermal management. This multi-functionality reduces the number of components needed and minimizes package size while ensuring reliable heat dissipation.
2Reliability
If protruding lead terminals are used for heat dissipation, then thermal management is improved, but light incidence efficiency to the light guide plate decreases
Solution Approach 1:
By integrating the heat dissipation function into the lead frame itself rather than using protruding separate heat sinks, the patent eliminates obstructions to light incidence. The lead frame's flat configuration allows light to pass unobstructed to the light guide plate while still providing effective thermal management through its extended surface area in contact with the LED chip.
3Productivity
If multiple LED chips are packaged separately, then each chip can be individually managed, but packaging efficiency and space utilization decrease
Solution Approach 1:
The patent integrates multiple LED chips onto a single lead frame structure, allowing multiple light sources to be packaged in one unified component. This increases packaging efficiency and reduces the number of individual packages needed, while the lead frame's design accommodates multiple chips with their respective electrical and thermal connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration extends the lifespan of LED chips, improves light efficiency, and enables a slim, efficient backlight unit with enhanced thermal resistance and luminosity retention.
Implementation Method 1
a heat sink provided separately from an external lead terminal to radiate heat generated from a light emitting diode chip to the outside
Implementation Method 2
the heat sink provided for radiation of heat may also be used as an external lead terminal
Data Source
Figure 1
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AI summary
A light emitting diode package may be provided that includes a light emitting diode chip and a heat sink. Heat generated from the light emitting diode chip may be radiated to the outside using the heat sink.