LED Package Height Uniformity via Segmented PCB Bonding
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Solution Overview
Problem
Existing light emitting diode (LED) package modules face challenges in achieving uniform height and preventing tilting on printed circuit boards, which affects the uniform arrangement and luminescent efficiency of backlight units.
Innovation Solution
A light emitting diode package module is designed with a printed circuit board and wiring film configuration, where the LED package is bonded using an adhesive agent, ensuring uniform height and preventing horizontal and vertical tilting by alternating regions and sections for secure electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LED packages are bonded directly to printed circuit boards using conventional methods, then the bonding process is simple, but height variation and tilting occur affecting uniform arrangement
Solution Approach 1:
The printed circuit board is divided into alternately disposed first regions and second regions, where first regions receive LED packages and second regions are adhered to the wiring film. This segmentation allows differential bonding approaches that compensate for height variations and prevent tilting, achieving uniform height without overcomplicating the overall bonding structure.
Solution Approach 2:
Different regions of the printed circuit board are given different functions: first regions are designed to receive and support LED packages while second regions are adhered to the wiring film for electrical connection. This local differentiation enables precise control over height uniformity and prevents tilting by creating a balanced support system across the board.
2Reliability
If LED packages are bonded to printed circuit boards, then electrical connection is achieved, but tilting occurs horizontally and vertically
Solution Approach 1:
The wiring film is divided into first sections and second sections alternately disposed, with second sections adhered to second regions of the printed circuit board. This segmentation creates a stable, distributed bonding network that prevents tilting while maintaining reliable electrical connections to LED packages.
Solution Approach 2:
The wiring film integrates both electrical connection functions and mechanical support functions by adhering its second sections to the printed circuit board's second regions. This merging of functions ensures that electrical connections are maintained while the wiring film itself acts as a stabilizing element preventing package tilting.
3Productivity
If conventional bonding methods are used, then the manufacturing process is fast, but uniform arrangement and luminescent efficiency are compromised
Solution Approach 1:
By segmenting the printed circuit board into first and second regions with alternating patterns, the design enables a bonding process that achieves both speed and precision. The segmented structure allows for parallel processing and standardized bonding steps that maintain high productivity while ensuring uniform arrangement and optimal luminescent efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform height and secure bonding of LED packages, preventing tilting and enhancing the uniform arrangement and luminescent efficiency of backlight units.
Implementation Method 1
bonded using an adhesive agent, ensuring uniform height and preventing horizontal and vertical tilting
Data Source
AI summary
A light emitting diode package module includes a printed circuit board, a wiring film and light emitting diode packages. The printed circuit board includes first regions and second regions, which are alternately disposed. The wiring film is disposed over the printed circuit board and includes first sections and second sections, which are alternately disposed. Each diode package is disposed between one of the first regions and one of the first sections. The light emitting diode package is electrically connected to the wiring film. The second sections and the second regions are adhered to each other so that the wiring film and the printed circuit board are electrically connected.