LED Package Anti-Humidity Particles for Water Resistance
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Solution Overview
Problem
Conventional white LED packages face reliability and water resistance issues due to phosphor powder hydrolysis and oxidation in high temperature and moisture environments, leading to reduced luminance and non-uniform color, and dense packaging materials often break conductive bonding wires, reducing yield.
Innovation Solution
An LED package design incorporating a carrier, encapsulant, phosphor particles, and anti-humidity particles, where the anti-humidity particles absorb moisture, preventing phosphor degradation and using inorganic hydrophilic oxides or organic polymers with hydrophilic functional groups to enhance water resistance and prevent bonding wire breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dense silica gel or resin is employed to package the LED, then water resistance is improved, but conductive bonding wires are prone to be broken
Solution Approach 1:
The patent changes the density parameter of the encapsulating material from high (conventional silica gel or resin) to low (low-density silica gel), and compensates by adding anti-humidity particles to achieve the desired water resistance without the mechanical harshness of dense materials
Solution Approach 2:
The patent creates a composite packaging material by combining low-density silica gel with anti-humidity particles, achieving both the mechanical gentleness needed to protect bonding wires and the water resistance needed to protect phosphor powder
2Illumination intensity
If phosphor powder is used to generate white light, then multicolor and high illumination are achieved, but phosphor is apt to be hydrolyzed or oxidized
Solution Approach 1:
The patent introduces anti-humidity particles as intermediary substances that absorb moisture and prevent direct contact between water and phosphor powder, thereby protecting the phosphor from hydrolysis and oxidation while maintaining the white light generation function
Solution Approach 2:
The patent converts the harmful effect of moisture (which causes phosphor degradation) into a beneficial function by using anti-humidity particles to actively absorb and trap moisture, turning the potential harm into a protective mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The LED package achieves improved reliability, water resistance, and increased light-emitting luminance with extended lifespan, while avoiding the need for high-density encapsulating materials, thus maintaining product yield.
Implementation Method 1
the anti-humidity particles absorb moisture, preventing phosphor degradation
Implementation Method 2
phosphor particles and the anti-humidity particles are distributed within the encapsulant. A first light emitted from the LED chip excites the phosphor particles to emit a second light
Data Source
AI summary
A light emitting diode (LED) package includes a carrier, an LED chip, an encapsulant, a plurality of phosphor particles, and a plurality of anti-humidity particles. The LED chip is disposed on and electrically connected to the carrier. The encapsulant encapsulates the LED chip. The phosphor particles and the anti-humidity particles are distributed within the encapsulant. A first light emitted from the LED chip excites the phosphor particles to emit a second light. Some of the anti-humidity particles are adhered onto a surface of the phosphor particles, while the other anti-humidity particles are not adhered onto the surface of the phosphor particles. The anti-humidity particles absorb H2O so as to avoid H2O from being reacted with the phosphor particles. The LED package of the present application has favorable water resistance.