LED Package Insulating Layer Design for Thermal Dissipation and Short Circuit Prevention

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Light-emitting element packages face challenges in thermal dissipation and short circuit prevention, particularly when exposed to water or chemicals, due to the design of the package body which requires both thermal management and insulation to prevent electrical shorts.

Innovation Solution

A light-emitting element package design featuring a cavity with a conductive lower body, an insulating layer, and a conductive upper body, where the first conductive type semiconductor layer is connected to the lower body and the second conductive type semiconductor layer is connected to the upper body, with a light-transmitting member in the upper portion, ensuring insulation and improved thermal dissipation through specific height ratios and insulating materials like polyimide and photoimageable solder resist.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the package body is made of conductive material to improve thermal dissipation, then thermal dissipation efficiency is improved, but the risk of short circuit increases

Engineering Contradiction:
Improvethermal dissipation efficiencyVSAvoidshort circuit prevention
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The package body is divided into upper and lower portions with an insulating layer between them. The lower body can be conductive for thermal dissipation, while the upper body is insulated, preventing short circuits. This segmentation allows different regions to have different electrical properties optimized for their specific functions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the package body have different material properties: the lower body is made conductive for thermal management, while the upper body is made insulating for electrical isolation. This local differentiation of material properties resolves the contradiction between thermal dissipation and short circuit prevention.

Inventive Principle:
Principle #3Local quality

2Reliability

If an insulating layer is added between upper and lower bodies to prevent short circuit, then short circuit prevention is improved, but device complexity increases

Engineering Contradiction:
Improveshort circuit preventionVSAvoidpackage structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The insulating layer serves multiple functions simultaneously: it provides electrical isolation between the upper and lower bodies to prevent short circuits, and also acts as a structural bonding layer that joins the two bodies together. This multi-functionality reduces the need for additional components and simplifies the overall structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If the height of the insulating layer is increased to improve insulation, then insulation performance is improved, but light efficiency decreases

Engineering Contradiction:
Improveinsulation performanceVSAvoidlight efficiency
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The height of the insulating layer is optimized to a specific range (10-30 μm) that balances insulation performance with light transmission. This parameter optimization ensures sufficient electrical isolation while minimizing the impact on light efficiency, resolving the contradiction between these two requirements.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively prevents short circuits from foreign materials and enhances thermal dissipation efficiency, maintaining light efficiency and insulation while reducing the risk of cracks and breakages in the insulating layers.

Implementation Method 1

an upper body (200) including a lateral surface of the cavity, and a first insulating layer (300) disposed between the lower body and the upper body

Methodology Applied
Scientific EffectElectrical insulation: Electrical Resistance

Implementation Method 2

the lower body (100) includes a first conductive body (110) and a second conductive body (120) disposed and insulated from the first conductive body

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11715817B2Light-emitting element package and light-emitting element module including same
Publication Date: 2023.08.01 SUZHOU LEKIN SEMICON CO LTD
  • US11715817B2 patent drawing
  • US11715817B2 patent drawing
  • US11715817B2 patent drawing

AI summary

Disclosed in an embodiment is a light-emitting element package comprising: a body including a cavity; a light-emitting element arranged on the bottom surface of the cavity and including a first conductive type semiconductor layer, a second conductive type semiconductor layer and an active layer, which is arranged between the first conductive type semiconductor layer and the second conductive type semiconductor layer; and a light-transmitting member arranged on the upper part of the cavity, wherein the body includes: a lower body including the bottom surface of the cavity; an upper body including the lateral surface of the cavity; and a first insulating layer arranged between the lower body and the upper body, the lower body includes a first conductive body and a second conductive body insulated and arranged together with the first conductive body, the first conductive type semiconductor layer is electrically connected with the first conductive body, the second conductive type semiconductor layer is electrically connected with the second conductive body, and the height from the lower surface of the lower body to the bottom surface of the cavity is less than the height from the lower surface of the lower body to the lower surface of the first insulating layer.