LED Package with Integrated Electrode Heat Dissipation
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Solution Overview
Problem
Existing LED package structures face challenges in achieving high heat dissipation and high light intensity, particularly in high-temperature environments, due to the use of bulky cooling fins that hinder close packing of LEDs and limit illumination intensity, and struggle to integrate multiple wavelength light sources effectively.
Innovation Solution
A high heat dissipation LED package structure featuring two or more light cups with lateral emission, utilizing a composite material base and metal plates that serve as both electrodes and heat dissipation structures, allowing for efficient heat transfer through air convection and minimal space usage, enabling close arrangement of light cups for enhanced light intensity and multiple wavelength output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling fins are used to dissipate heat, then heat dissipation effect is improved, but device volume increases and LEDs cannot be arranged close to one another
Solution Approach 1:
The patent merges the electrode function and heat dissipation function into a single integrated structure. The electrode extends from the LED through the substrate and is exposed on the outer peripheral surface, simultaneously serving as both an electrical connection component and a heat dissipation component, eliminating the need for separate cooling fins
Solution Approach 2:
The electrode is designed to perform multiple functions: it provides electrical connection for the LED, serves as a heat dissipation pathway by extending to the outer peripheral surface, and enables lateral light emission when multiple light cups are arranged side by side. This multi-functionality resolves the contradiction by eliminating dedicated cooling fins
2Temperature
If cooling fins are used to dissipate heat, then heat dissipation effect is improved, but illumination intensity is reduced due to insufficient LED arrangement density
Solution Approach 1:
By combining the electrode and heat dissipation structure into one integrated component, the patent removes the spatial barrier that cooling fins created between LEDs. This allows LEDs to be arranged densely side by side, increasing total light output and illumination intensity while maintaining effective heat dissipation through the integrated electrode structure
Solution Approach 2:
The heat dissipation function is extended to the outer peripheral surface of the substrate, utilizing the lateral dimension for heat dissipation. This dimensional extension allows LEDs to be arranged closely in the planar area without compromising heat dissipation capacity, thereby maintaining high illumination intensity
3Adaptability or versatility
If multiple wavelength light sources are integrated, then versatility is improved, but heat dissipation becomes more challenging
Solution Approach 1:
The integrated electrode structure serves as a universal heat dissipation pathway that can handle thermal loads from multiple wavelength LEDs simultaneously. By exposing the electrode on the outer peripheral surface, it provides a common thermal management solution for diverse light sources integrated in different light cups
Solution Approach 2:
The substrate is divided into multiple light cups that can accommodate different wavelength LEDs independently, while the electrode structure provides unified heat dissipation. This segmentation allows versatile multi-wavelength integration while maintaining effective thermal management through the shared exposed electrode structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective heat dissipation and high light intensity while minimizing space usage, allowing for side-by-side arrangement of light cups and supporting multiple wavelength light sources without overheating, thus addressing the limitations of prior art in high-temperature applications.
Implementation Method 1
heat in the LED device can be directly transmitted with high efficiency to outside the LED through the at least two first metal plates
Implementation Method 2
enhance heat dissipation effects by air convection
Data Source
AI summary
A present invention includes at least two light cups and a composite material base. The composite material base comprises a first surface, a second surface and a third surface adjacent to the first surface, and a fourth surface opposite to the first surface. The at least two light cups are formed on the first surface. At least two first metal plates and at least two second metal plates having different polarities and corresponding to the quantity of the light cups are provided on the second surface. One ends of the at least two first and second metal plates individually pass through the composite material base and extend into the light cup to form two electrode contacts, and the other ends of the at least two first metal plates extend to the fourth surface to form an exposed heat dissipation structure.