LED Package Structure Integrating Control Chip and Inductor
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Solution Overview
Problem
Conventional LED illumination modules face challenges in miniaturization and efficiency due to the large area occupied by the drive circuit, which affects the integration of components and illumination efficiency.
Innovation Solution
A package structure for the power circuit that integrates a control chip, passive elements, and an inductive element, with a connector to connect the inductive element to the power device, and multiple pins for external electrical connection, reducing the area occupied by the drive circuit and preventing mutual interference between pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If optical components and electrical components are integrated in the LED illumination module, then the number of components and assembly cost are reduced, but the area occupied by the drive circuit increases
Solution Approach 1:
The patent combines the control chip, passive elements (resistors, capacitors, diodes), and inductive element into a single integrated package structure. This merging of multiple electrical components into one unified package reduces the overall number of discrete components and their associated assembly operations, while the three-dimensional arrangement within the package minimizes the footprint area occupied by the drive circuit on the lamp board.
Solution Approach 2:
The package structure employs a nested arrangement where the control chip, passive elements, and inductive element are housed within a single package body. The inductive element is positioned above the first package body, and components are arranged in multiple layers and orientations, effectively nesting components within the package to reduce the overall area occupied on the lamp board while maintaining all necessary electrical connections.
2Volume of moving object
If more components are integrated in the LED illumination module, then miniaturization is achieved, but mutual interference between pins occurs
Solution Approach 1:
The package structure segments the drive circuit into distinct functional zones: the control chip area, passive element mounting areas, and inductive element area. The connector design separates high-voltage terminals from low-voltage signal terminals, with specific spacing and orientation arrangements that prevent electrical interference. This segmentation allows miniaturization while maintaining circuit reliability by isolating potentially interfering components.
Solution Approach 2:
The package structure implements local quality optimization by positioning high-voltage terminals of the connector at specific locations away from sensitive signal pins, and by orienting the inductive element above the package body rather than adjacent to it. This strategic local arrangement of components and terminals prevents mutual interference while achieving compact integration, ensuring circuit stability in the miniaturized design.
3Productivity
If the drive circuit area is reduced, then illumination efficiency is improved, but circuit safety and stability may be compromised
Solution Approach 1:
The package structure transitions from a two-dimensional planar arrangement to a three-dimensional configuration. The inductive element is positioned above the first package body, and components are arranged in multiple vertical layers within the package. This dimensional change allows the drive circuit to be compacted without increasing the footprint area on the lamp board, thereby improving illumination efficiency while maintaining circuit safety through proper spatial separation of high-voltage and low-voltage terminals.
Solution Approach 2:
The connector serves as an intermediary element that mediates between the inductive element and the control chip, with its terminals strategically positioned to provide electrical connections while maintaining safe spacing. The package body acts as a protective intermediary that shields and organizes the internal components, ensuring circuit stability and safety while enabling the compact integrated design that improves illumination efficiency.
Data Source
AI summary
A package for a power supply circuit and an LED illumination module are provided. The package includes: a first package body, configured to package a power device, a control chip and a passive element; an inductive element; a connector configured to connect an electrode of the inductive element to a corresponding electrode of the power device; an encapsulant configured to encapsulate the first package body, the inductive element and the connector; and multiple pins exposed through the encapsulant and configured to achieve external electrical connection. In the package, the control chip, the inductive element and the passive element are packaged together, thereby reducing an area occupied by the drive circuit in the LED illumination module.