Light Emitting Device Package With Inverted Resin Molding
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Solution Overview
Problem
Conventional methods for manufacturing light emitting device packages face challenges in achieving efficient heat dissipation and moisture resistance while maintaining a reduced thickness, and require complex lead bending processes.
Innovation Solution
A package design featuring a first and second electrode with metal-covered outer lead portions and a resin with wall and flange portions that secure the electrodes, allowing for efficient optical reflection and improved mountability, along with a method of injecting resin from the outside of the package forming area, eliminating the need for lead bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional molding methods are used with lead frames placed in bottomed recesses, then the package structure is stable, but the manufacturing process becomes complex requiring lead bending
Solution Approach 1:
Instead of placing the lead frame first and then molding resin around it (conventional method), this invention inverts the sequence by pre-forming the resin mold cavity and then embedding the lead frame into the recess. This eliminates the need for complex lead bending operations while maintaining structural stability, as the lead frame is simply placed and secured in the pre-formed recess without requiring post-molding bending.
2Length of stationary object
If the package thickness is reduced, then the device becomes more compact, but heat dissipation and moisture resistance become insufficient
Solution Approach 1:
The invention uses a composite structure where a resin material forms the package body with integrated bottomed recesses. The resin provides both mechanical support and environmental protection (moisture resistance) while allowing for reduced thickness. The lead frame embedded in the recess creates a composite assembly that maintains structural integrity and protective barriers against moisture ingress even in a thin profile.
3Length of stationary object
If the package thickness is reduced, then the device becomes more compact, but heat dissipation capability deteriorates
Solution Approach 1:
The resin material acts as an intermediary thermal management component. While the overall package thickness is reduced, the resin fills the bottomed recess and provides a thermal pathway for heat dissipation. The lead frame embedded in the resin also serves as a heat sink, creating multiple thermal pathways that enable effective heat management despite the compact thin profile.
Data Source
AI summary
A package includes a first electrode and a second electrode that are located at a bottom portion of a bottomed recess, and a first resin securing the first electrode and the second electrode in place and forming a part of the bottomed recess. The first electrode has a first outer lead having a first indentation at a tip in a plan view. The second electrode has a second outer lead having a second indentation at a tip in a plan view. The first resin has at least a portion between the first electrode and the second electrode located at the bottom portion of the bottomed recess, wall portions structuring lateral walls of the bottomed recess, and flange portions having the same thickness as a thickness of the first outer lead and different outward widths from the wall portions on both sides of the first outer lead in a plan view.