LED Package Lateral Heat Dissipation via Radiating Layer
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Solution Overview
Problem
Conventional LED packages primarily rely on vertical heat transfer paths, limiting their heat radiating performance despite the use of high heat conductivity materials, as most heat is transferred vertically and not laterally, even with large heat sinks.
Innovation Solution
Incorporating a heat radiating layer on the upper surface of the package substrate with a larger area than the LED chip, providing horizontal heat transfer paths and using high heat conductivity materials like metal or ceramic films, or composite materials with carbon nano tubes to enhance lateral heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a large sized heat sink or heat sink substrate is used, then the heat radiating area is increased, but the heat transfer path area remains limited to vertical direction only
Solution Approach 1:
The patent introduces a heat radiating layer extending in the lateral direction (X-Y plane) on the package substrate, transforming the heat transfer from purely vertical (one-dimensional) to include lateral pathways (two-dimensional). This dimensional expansion allows heat to dissipate across a broader area rather than being constrained to vertical conduction only.
Solution Approach 2:
The heat radiating layer is divided into multiple segments including a first heat radiating layer, second heat radiating layer, and third heat radiating layer extending in different lateral directions. This segmentation creates multiple independent heat transfer pathways, distributing the heat flow across various routes and preventing thermal bottlenecks.
2Device complexity
If heat transfer is limited to vertical path through bonding area, then the structure is simple, but heat radiating performance is insufficient
Solution Approach 1:
The patent merges the heat radiating function with the existing package substrate structure by integrating the heat radiating layer into the substrate's upper surface. This combination allows the substrate to simultaneously serve as both the mounting platform and the heat dissipation pathway, eliminating the need for completely separate heat management components.
Solution Approach 2:
The package substrate is designed to perform multiple functions: it serves as the mechanical support for mounting the LED chip, provides electrical connection pathways through conductive leads, and simultaneously acts as a heat radiating structure through the integrated heat radiating layer. This multi-functionality reduces overall device complexity while improving heat management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat radiating performance by creating additional lateral heat transfer paths, allowing for more efficient heat dissipation across a wider area, thereby enhancing the reliability of high power LED packages.
Implementation Method 1
a heat radiating layer arranged on the package substrate with an area at least larger than a mounting area of a LED chip to provide a horizontal heat radiating path
Implementation Method 2
using high heat conductivity materials like metal or ceramic films, or composite materials with carbon nano tubes to enhance lateral heat transfer
Data Source
AI summary
An LED package is improved in heat radiating performance. The LED package includes a package substrate having heat radiating means; a heat radiating layer arranged on the package substrate with an area at least larger than a mounting area of a light emitting diode chip to provide a horizontal heat radiating path; and an electrically-connecting structure including first and second conductive leads arranged on the heat radiating layer. The light emitting diode chip is mounted on the heat radiating layer or the first conductive lead by a heat conductive adhesive layer.