Lead Frame Bending for LED Package Integrity
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Solution Overview
Problem
The compact size of side view type light emitting device packages limits the size and number of mountable devices, and the resin material is prone to thermal degradation due to heat and light exposure, with the lead frame bending causing potential damage to the package body.
Innovation Solution
The lead frame is extended outward and bent to be level with the package body's surface, and light emitting devices are aligned on the longitudinal center axis to enhance luminance uniformity and prevent damage during bending, while an electrostatic discharge device is used to protect the devices from external shocks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the lead frame is bent toward the outer surface of the package body, then the lead frame can be mounted and connected, but the package body may be damaged due to the bending force
Solution Approach 1:
The lead frame is extended beyond the outer surface of the package body before bending, creating a buffer zone that allows the bending force to be applied away from the body. This preliminary extension prevents direct transmission of bending stress to the package body, thereby enabling lead frame mounting while maintaining body integrity.
2Volume of moving object
If the package body is reduced in size to achieve a compact design, then the overall package becomes smaller and slimmer, but the lead frame size and thickness are limited which may cause damage during bending
Solution Approach 1:
The lead frame is extended in the longitudinal direction beyond the outer surface of the package body, utilizing the length dimension to provide additional bending margin. This dimensional extension allows the lead frame to accommodate bending forces without requiring increased thickness, thus maintaining compact package size while improving bending resistance.
3Ease of manufacture
If light emitting devices are disposed off-center in the package body, then the packaging process is simplified, but the luminance uniformity of emitted light is reduced
Solution Approach 1:
The patent specifies that light emitting devices should be disposed symmetrically on the longitudinal center axis of the package body. This asymmetric positioning requirement (relative to off-center placement) ensures that light is emitted uniformly from the center, improving luminance uniformity while still allowing for simplified packaging processes through standardized mounting locations.
Data Source
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AI summary
A light emitting device package is provided comprising a light emitting device (30,40,50) including at least one light emitting diode and a body (10) including a first lead frame (92) on which the light emitting device is mounted and a second lead frame (91) spaced apart from the first lead frame, wherein at least one of the first and second lead frames is extending to a bending region (BD) in a first direction by a predetermined length on the basis of an outer surface of the body and is bent in a second direction intersecting the first direction.