LED Package Lead Frame with Reflective Cavities
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Solution Overview
Problem
The manufacturing costs of light emitting device packages, such as LEDs, are high due to complex packaging processes and material costs, necessitating a simplification of the manufacturing process and reduction in material usage.
Innovation Solution
A lead frame design that integrates light emitting device chips in series or parallel circuits with reflective cavities and bonding members, allowing for direct connection to a socket or connector without soldering to a PCB, using a metal plate material like aluminum or copper, and forming reflective cavities from insulating resin to enhance light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional two-stage packaging process is used (mounting LEDs on lead frame, then mounting on PCB), then reliable electrical connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the lead frame and PCB into a single integrated substrate structure. The lead frame serves both as the mounting platform for LED chips and as the final circuit board that can be directly installed in applications. This eliminates the need for the second packaging process of mounting the entire assembly onto a separate PCB, thereby reducing manufacturing complexity while maintaining electrical connection reliability through the integrated design.
2Reliability
If traditional lead frame design is used, then electrical connection is achieved, but light extraction efficiency is limited
Solution Approach 1:
The patent applies local quality by creating reflective cavities at specific locations beneath each LED chip on the lead frame. These localized reflective structures are positioned precisely where light extraction is needed, while other areas of the lead frame maintain their electrical connection functions. This localized modification enhances light extraction efficiency without compromising the overall electrical connection reliability of the lead frame structure.
3Adaptability or versatility
If multiple separate components are used (lead frame, PCB, mounting structures), then functional requirements are met, but material cost increases
Solution Approach 1:
The patent makes the lead frame universal by designing it to perform multiple functions simultaneously: it serves as the mounting platform for LED chips, provides electrical connections through its conductive traces, offers mechanical support as a structural substrate, and enables light extraction through integrated reflective cavities. This multi-functional design eliminates the need for separate PCB and mounting structures, thereby reducing material cost while fulfilling all necessary functional requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the packaging process, reduces material costs, and improves light extraction efficiency by reflecting and guiding emitted light, enabling the creation of a compact, efficient illumination module for various applications.
Implementation Method 1
reflective cavities reflecting light emitted from each of the plurality of light emitting device chips and guiding the reflected light to the outside
Data Source
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AI summary
Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.