Directly Connected LED Package Lead Frames for Backlight Assembly
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Solution Overview
Problem
Conventional liquid crystal display (LCD) backlight assemblies using LEDs face challenges in achieving high luminance and efficient electrical connectivity without the need for printed circuit boards (PCBs) or wires.
Innovation Solution
A light source unit comprising directly electrically connected LED packages, where each package includes an LED chip, a lead frame for current supply, and a housing, with the lead frames of adjacent packages contacting each other to form a direct electrical connection, eliminating the need for external power sources like PCBs or wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If LED packages are connected using conventional PCB and wire methods, then electrical connectivity is achieved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges the electrical connection function directly into the lead frame structure of adjacent LED packages. The lead frames are designed to extend and contact each other, eliminating the need for separate PCB and wire connections. This integration reduces device complexity while maintaining reliable electrical connectivity between LED packages.
2Ease of manufacture
If more manufacturing components (PCB, wires) are used for LED connection, then electrical connectivity is ensured, but manufacturing precision requirements increase
Solution Approach 1:
The patent extracts the electrical connection function from separate components (PCB and wires) and integrates it directly into the LED package lead frames. This eliminates the need for additional manufacturing steps involving PCB mounting and wire bonding, thereby reducing manufacturing precision requirements for connection alignment while simplifying the overall manufacturing process.
3Device complexity
If LED packages are directly electrically connected, then manufacturing complexity is reduced, but manufacturing precision for direct contact is required
Solution Approach 1:
The patent applies preliminary action by pre-configuring the lead frames during LED package manufacturing to extend and position themselves for direct contact with adjacent packages. The lead frames are designed with specific geometries and positions that ensure proper alignment and contact before the packages are mounted in the backlight assembly, thereby reducing the manufacturing precision requirements during final assembly while maintaining direct electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient power supply and electrical connectivity between LED packages, enhancing luminance and reducing manufacturing complexity, while enabling the direct mounting of LED packages on a fixing member within the backlight assembly.
Implementation Method 1
a lead frame which supplies current to the LED chip, wherein an end of the lead frame of the first LED package directly contacts an end of the lead frame of the second LED package
Data Source
AI summary
Provided are a light source unit including a plurality of light-emitting diode (LED) packages, which are directly electrically connected to each other, and a backlight assembly having the light source unit. The light source unit includes a first LED package and a second LED package which are adjacent to each other, wherein each of the first LED package and the second LED package includes an LED chip, a lead frame which supplies current to the LED chip, and a housing which fixes the LED chip and the lead frame in place, wherein an end of the lead frame of the first LED package directly contacts an end of the lead frame of the second LED package.