LED Package Lead Frame Heat Dissipation Structure
Solution Overview
Problem
LED-based lamps face challenges in heat dissipation, leading to increased temperature, wavelength shift, and brightness reduction, which affect their performance and reliability.
Innovation Solution
A light emitting device package design with a specific lead frame structure and heat dissipation mechanisms, including a heat dissipation member and reflective patterns, to efficiently manage heat and maintain light quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LED light emitting chips are used to provide high brightness and low power consumption, then energy efficiency and visibility are improved, but heat generation increases causing temperature rise that affects wavelength stability and brightness maintenance
Solution Approach 1:
The patent introduces an intermediate heat dissipation structure between the LED chip and the package body. This intermediate layer acts as a thermal mediator that conducts heat away from the light emitting chip while maintaining electrical isolation, thus resolving the contradiction between maintaining low power consumption and controlling temperature rise.
Solution Approach 2:
The patent implements heat dissipation pathways in multiple dimensions - vertically through the intermediate layer to the package body, and laterally through the lead frame structure. This multi-dimensional heat dissipation approach effectively manages thermal load while preserving the LED's energy efficiency characteristics.
2Reliability
If heat dissipation measures are implemented to suppress temperature increase, then wavelength shift and brightness reduction are prevented, but device complexity increases
Solution Approach 1:
The patent combines the heat dissipation function with the existing lead frame and package body structure. The intermediate layer is integrated into the sealing cavity structure, and the lead frame serves dual purposes as both electrical connection and thermal conduction path. This merging approach provides effective heat dissipation without significantly increasing device complexity.
Solution Approach 2:
The patent designs components to serve multiple functions: the lead frame provides both electrical connection and thermal conduction, the package body provides both sealing and heat dissipation, and the intermediate layer provides both mechanical support and thermal management. This multi-functionality reduces the need for additional dedicated heat dissipation components, thereby limiting complexity increase.
3Ease of manufacture
If the package body cavity is designed to accommodate light emitting chips and lead frames, then manufacturing ease is improved, but the overall device volume increases
Solution Approach 1:
The patent employs a nested structure where the lead frame is positioned within the package body cavity, and the intermediate layer is nested between the LED chip and the package body. This nesting arrangement maximizes space utilization and allows compact packaging while maintaining ease of assembly through standardized positioning features.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses temperature increase, prevents wavelength shift, and maintains brightness, enhancing the reliability and performance of LED-based lamps.
Implementation Method 1
The LEDs are devices which convert an electrical signal into ultraviolet light or visible light using characteristics of a compound semiconductor
Implementation Method 2
heat dissipation measures to suppress increase of the temperature of the light emitting chips are required
Data Source
AI summary
Disclosed is a light emitting lamp including a light source module including at least one light source and a light guide layer disposed on a substrate burying the at least one light source, and a housing accommodating the light source module, and the at least one light source includes a body having a cavity, a first lead frame including one end exposed to the cavity and the other end passing through the body and exposed to one surface of the body, a second lead frame including one end exposed to one portion of the surface of the body, the other end exposed to the another portion of the surface of the body, and an intermediate part exposed to the cavity, and at least one light emitting chip including a first semiconductor layer, an active layer and a second semiconductor layer, and disposed on the first lead frame.