LED Package Lead Frame Segmentation for Multi-Chip Mounting
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Solution Overview
Problem
Existing LED packages with reflective electrode layers are difficult to mount multiple LED chips, limiting the ability to manufacture packages that emit various colors of light.
Innovation Solution
The LED package features a package main body with a cavity and multiple lead frames, allowing for easy mounting of multiple LED chips with different electrode structures, and a method of manufacturing that includes forming lead frames within the package main body and bonding the chips to these frames, enabling efficient light emission of various colors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a reflective electrode layer structure is used in the LED package, then the light emission is improved, but it becomes difficult to mount multiple LED chips
Solution Approach 1:
The single reflective electrode layer is segmented into multiple separate lead frames, each capable of supporting individual LED chips. This segmentation allows multiple chips to be mounted independently while maintaining the reflective function for light extraction enhancement.
Solution Approach 2:
The lead frames serve multiple functions: they provide electrical connection to LED chips, act as reflective surfaces for light extraction enhancement, and serve as structural support for mounting multiple different types of LED chips with various electrode configurations.
2Adaptability or versatility
If multiple LED chips are mounted to emit various colors, then the color versatility is improved, but the device complexity increases
Solution Approach 1:
The lead frame structure is designed to accommodate various LED chip types (different colors, electrode configurations) using the same basic mounting and connection mechanism, reducing the need for different package designs for different color applications.
Solution Approach 2:
Different regions of the lead frames can be optimized for different chip types, with local variations in geometry and electrode configuration to match specific LED chip requirements while maintaining the overall simple package structure.
Data Source
AI summary
A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires connected to the plurality of LED chips, and a plurality of lead frames in the package body, wherein the lead frames comprise a first lead frame electrically connected to a first electrode of a first LED chip, a second lead frame electrically connected to a second electrode of the first LED chip and a second electrode of a second LED chip, a third lead frame electrically connected to a first electrode of the second LED chip, and fourth lead frame electrically connected to a second electrode of a third LED chip. Further, ends of the lead frames are exposed outside of the package body and penetrate the package body, and the first electrodes are P electrodes and the second electrodes are N electrodes.