Light-emitting Device Package Lead Frame Slots for Coupling Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light-emitting device packages face reliability issues due to property differences between metal lead frames and plastic molding materials, leading to unstable coupling and potential bending or widening, which affects light extraction efficiency.
Innovation Solution
The design incorporates a lead frame with inner and outer slots filled by a molding structure, including an outer barrier, inner barrier, and electrode separator, to enhance coupling reliability and light extraction efficiency by alleviating stress from property differences and improving the molding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a lead frame and molding material are coupled together, then the light-emitting device package is formed, but property differences between the metal lead frame and plastic molding material cause unstable coupling and potential bending or widening
Solution Approach 1:
The patent introduces a buffer layer as an intermediary substance between the metal lead frame and plastic molding material. This buffer layer has physical properties intermediate between metal and plastic, acting as a transition zone that reduces the property difference and thermal stress between the two materials, thereby preventing bending and widening while maintaining coupling stability
Solution Approach 2:
The patent creates a composite structure by combining the lead frame, buffer layer, and molding material into a multi-layer composite package. This composite approach allows each layer to contribute its specific properties while the overall structure benefits from reduced thermal stress and improved coupling stability through the intermediate buffer layer
2Reliability
If slots are formed in the lead frame, then the molding process is improved and coupling reliability is enhanced, but the device complexity increases
Solution Approach 1:
The patent divides the lead frame into multiple segments by forming slots that create recessed portions. This segmentation allows the molding material to better conform to the lead frame structure, improves coupling surface area, and enhances coupling reliability while the slots themselves are simple geometric features that do not significantly increase manufacturing complexity
Data Source
AI summary
A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.