LED Package Thermal Management via Liquid Filling
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Solution Overview
Problem
Conventional LED package structures face challenges in effectively dissipating heat generated by LED chips, particularly when driven under high current, leading to potential overheating and damage.
Innovation Solution
The proposed LED package structure incorporates a highly thermal-conductive transparent liquid that fills a sealed space with the LED chip, along with a carrier substrate and optional protrusions or pedestals made of thermal-conductive materials, to enhance thermal conduction efficiency by contacting the chip's bottom, sidewalls, and top, while maintaining light transmittance and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional LED package structure is used, then manufacturing is simple, but thermal conduction efficiency is poor leading to overheating
Solution Approach 1:
The patent introduces a highly thermal-conductive transparent liquid as an intermediary substance filling the sealed space between the LED chip and the external environment. This liquid mediates heat transfer from the LED chip sidewalls and top surface, complementing the carrier substrate's heat conduction from the bottom, thereby resolving the thermal conduction bottleneck without requiring fundamental structural changes
Solution Approach 2:
The patent applies hydraulic principles by using a liquid medium (highly thermal-conductive transparent liquid) to fill the sealed space and facilitate heat transfer. The liquid's fluidity allows it to contact all surfaces of the LED chip, providing uniform thermal conduction from multiple directions, which overcomes the limitation of solid-to-solid thermal contact
2Reliability
If heat dissipation is improved by adding thermal management structures, then thermal conduction efficiency increases, but device complexity increases
Solution Approach 1:
The highly thermal-conductive transparent liquid serves multiple functions simultaneously: it acts as a thermal conduction medium, provides electrical insulation, maintains the sealed space integrity, and enables light transmission. This multi-functionality improves reliability by preventing overheating while avoiding the need for separate dedicated thermal management components
Solution Approach 2:
The patent changes the thermal conductivity parameter of the filling medium by selecting a liquid with exceptionally high thermal conduction properties. This parameter change allows the liquid to efficiently conduct heat from the LED chip surfaces, improving reliability without adding complex thermal management structures
3Temperature
If thermal-conductive materials are added to contact LED chip surfaces, then thermal conduction improves, but light transmittance may be compromised
Solution Approach 1:
The patent applies local quality by using different materials for different parts of the LED package: the carrier substrate (typically ceramic or metal) provides thermal conduction from the bottom where light extraction is not needed, while the highly thermal-conductive transparent liquid fills the sealed space and contacts the LED chip sidewalls and top surface, providing thermal conduction while maintaining light transmittance in regions where light extraction occurs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves thermal conduction efficiency by transferring heat from the LED chip to the substrate and liquid, preventing overheating and enhancing light extraction and uniformity, thus extending the lifespan and performance of the LED package.
Implementation Method 1
the highly thermal-conductive transparent liquid fills up the sealed space... the carrier substrate below the LED chips helps to increase the thermal conduction efficiency of the bottom of the LED chip, and the highly thermal-conductive transparent liquid in contact with the LED chip helps to increase the thermal conduction efficiency of the sidewall and top of the LED chip
Implementation Method 2
The LED converts electrical energy into light. When the electric current is applied to the LED, energy is released in the form of light through the combination of the electrons and holes
Data Source
AI summary
A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.