Semiconductor Light-Emitting Package Layout for Low-Inductance Pulses
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Solution Overview
Problem
Semiconductor light-emitting devices used in LiDAR systems face challenges in reducing the inductance component, which is necessary for generating pulse waveforms with high current change rates and narrower pulse widths.
Innovation Solution
A semiconductor light-emitting device configuration with a sealing resin and conductor design that includes interconnecting and embedded portions, reducing the inductance component by offsetting electrodes and extending conductors perpendicular to the thickness direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of moving object
If the inductance component is reduced to generate pulse waveforms with high current change rates, then the pulse width can be narrowed, but the device structure becomes more complex
Solution Approach 1:
The conductor is configured to extend in the thickness direction (perpendicular to the element surfaces) rather than only in the plane direction. This dimensional change allows the conductor to achieve shorter current paths and reduced inductance by utilizing the third dimension (thickness direction) for current flow, thereby enabling narrower pulse widths without excessive planar complexity
Solution Approach 2:
The conductor is embedded within the sealing resin, with the sealing resin covering the semiconductor light-emitting element. This nested configuration integrates the conductor into the existing device structure, reducing inductance through optimized current path geometry while maintaining a compact overall device form factor
2Reliability
If the conductor extends perpendicular to the thickness direction to reduce inductance, then the current path is optimized, but the manufacturing process becomes more difficult
Solution Approach 1:
The conductor is formed within the sealing resin before final assembly, with the sealing resin covering the semiconductor light-emitting element. This preliminary formation of the conductor in the thickness direction allows for optimized current paths while simplifying subsequent manufacturing steps, as the conductor is already positioned correctly within the sealed structure
Solution Approach 2:
The sealing resin serves as an intermediary medium that both protects the semiconductor light-emitting element and provides a matrix for embedding the conductor. This dual function of the sealing resin simplifies manufacturing by combining protection and conductor integration into a single component
Data Source
AI summary
A semiconductor light-emitting device includes light-emitting element, sealing resin and conductor. The light-emitting element has first and second surfaces spaced apart in a thickness direction with first element electrode on the first surface and with second element electrode on the second surface. The sealing resin covers at least the second surface. The conductor, forming a conduction path to the light-emitting element, includes a first interconnecting portion, an embedded portion, and a second interconnecting portion. The sealing resin has a cavity extending in the thickness direction and connected to the second element electrode. The first interconnecting portion is electrically connected to the first element electrode and extends in a direction crossing the thickness direction. The embedded portion is in the cavity and connected to the second element electrode. The second interconnecting portion is connected to the embedded portion and extends in the direction crossing the thickness direction.