Light Emitting Device Package with Segmented Bodies and Magnetic Alignment
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Solution Overview
Problem
Existing light emitting device packages face challenges in matching different form factors, bonding strength, electrical and physical reliability, thermal and electrical reliability, and manufacturing efficiency, particularly during high-power applications and reflow processes.
Innovation Solution
A light emitting device package design featuring a modular structure with a first package body and a second package body, including a recess for increased bonding strength, and conductive layers in openings for enhanced reliability, along with an adhesive layer and magnetic material layers for self-alignment and attachment, and a heat dissipation member for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional light emitting device package structure is used, then the device can be manufactured with standard processes, but the bonding strength between package body and light emitting device is insufficient and reliability decreases during reflow processes
Solution Approach 1:
The package body is divided into multiple sections with different functions: a first package body portion for mounting the light emitting device, a second package body portion for sealing, and a heat dissipation member integrated into the structure. This segmentation allows each part to be optimized for its specific function, improving bonding strength at the mounting interface while maintaining manufacturability through modular construction
Solution Approach 2:
The package structure combines multiple materials with different properties: a metal or metal alloy package body for structural strength and heat dissipation, a ceramic or glass seal for hermetic sealing, and specialized bonding materials at interfaces. This composite approach ensures strong bonding between dissimilar materials while maintaining overall reliability during thermal cycling and reflow processes
2Power
If high-power light emitting devices are used, then light output and efficiency are improved, but thermal management becomes difficult and electrical reliability decreases
Solution Approach 1:
A heat dissipation member is introduced as an intermediary between the high-power light emitting device and the package body. This intermediate structure provides a dedicated thermal management pathway, conducting heat away from the device while maintaining electrical isolation where needed. The heat dissipation member may include heat sinks, thermal vias, or heat spreaders that interface directly with the device substrate
Solution Approach 2:
The package body is designed to perform multiple functions simultaneously: providing mechanical support and structural integrity, conducting heat away from the light emitting device, providing hermetic sealing to protect internal components, and establishing electrical connections. This multi-functionality allows the package to handle high-power devices effectively without requiring separate systems for each function
3Adaptability or versatility
If different form factors are required for various applications, then product versatility is improved, but manufacturing efficiency decreases and costs increase
Solution Approach 1:
The package is designed with modular segments that can be configured in different arrangements to create various form factors. The first and second package body portions can be shaped differently depending on application requirements, while maintaining the same fundamental bonding and sealing principles. This allows standardization of the bonding process across different form factors while accommodating application-specific geometric requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient matching of various form factors, enhances bonding strength and reliability, improves thermal and electrical performance, and increases manufacturing efficiency, preventing re-melting phenomena and reducing manufacturing costs.
Implementation Method 1
a first magnetic material layer and a second magnetic material layer, wherein the first package body and the second package body are self-aligned and self-attached by magnetic force
Implementation Method 2
an adhesive layer disposed between the first package body and the second package body
Implementation Method 3
a heat dissipation member provided in the first package body
Data Source
AI summary
Embodiments relate to a light emitting device package and a light source device. A light emitting device package according to the embodiment may include a first package body; a second package body disposed on the first package body, and comprising an opening passing through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and comprising a first bonding part and a second bonding part. The first package body may include a first opening and a second opening that pass through an upper surface and a lower surface of the first package body. The upper surface of the first package body may be coupled with the lower surface of the second package body, the first bonding part may be disposed on the first opening, and the second bonding part may be disposed on the second opening.