Light-Emitting Element Package With Multi-Layer Metallic Pattern

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Solution Overview

Problem

Existing electronic component mounting packages face challenges in achieving efficient heat dissipation and light reflection, particularly when housing light-emitting elements, due to limitations in material selection and packaging design.

Innovation Solution

The electronic component mounting package incorporates an insulating base body with a recess and a metallic pattern featuring layers such as tungsten, nickel, and an aluminum outermost layer, along with a wiring conductor with corrosion-resistant plating, to enhance heat dissipation and light reflection by using a ceramic or resin material with high thermal conductivity and strategically designed recess angles for improved light emission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a light-emitting element housing package is used with conventional materials and design, then the structure is simple and easy to manufacture, but heat dissipation efficiency is insufficient and light reflection is inadequate

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidpackaging structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent employs a composite metallic pattern consisting of multiple layers including a tungsten layer, nickel layer, and aluminum layer. This multi-layer composite structure combines the high thermal conductivity of tungsten with the reflective properties of aluminum, achieving both efficient heat dissipation and superior light reflection while maintaining a relatively simple packaging form.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The metallic pattern is strategically positioned on specific surfaces of the housing package - particularly on the inner wall of the recess and the principal face - to provide localized heat dissipation and light reflection functions where most needed, rather than uniformly throughout the entire structure.

Inventive Principle:

Principle #3Local quality

2Reliability

If conventional metallic patterns are used without corrosion-resistant plating, then the manufacturing process is simpler, but the wiring conductor suffers from corrosion and reduced reliability

Engineering Contradiction:

Improvecorrosion resistance of wiring conductorVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

A corrosion-resistant metallic pattern serves as an intermediary protective layer between the wiring conductor and the corrosive environment. This intermediate layer prevents direct contact between the conductor and corrosive substances, thereby enhancing reliability without fundamentally altering the manufacturing process.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If joining materials are applied extensively to seal the package, then sealing effectiveness is improved, but interference with light reflection increases and optical performance deteriorates

Engineering Contradiction:

Improvesealing effectivenessVSAvoidlight reflection performance

Core Design Contradiction:

ReliabilityVSIllumination intensity

Solution Approach 1:

Joining materials are applied selectively only at specific sealing locations where they are functionally required, rather than covering entire surfaces. This localized application maintains sealing effectiveness while minimizing the area where joining materials could interfere with light reflection, thus preserving optical performance.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The function of light reflection is extracted and assigned to the dedicated metallic pattern with high reflective properties, while joining materials are restricted to sealing functions only in specific areas, thereby separating the optical function from the sealing function and eliminating mutual interference.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables effective heat dissipation and enhances light reflection, leading to improved performance and efficiency in electronic devices by maintaining high thermal conductivity and minimizing interference from joining materials during light reflection.

Implementation Method 1

an aluminum layer as an outermost layer, the metallic pattern including an exposed portion corresponding to a part of the metallic layer exposed at the principal face

Methodology Applied

Scientific EffectLight reflection: Reflection

Implementation Method 2

using a ceramic or resin material with high thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11552220B2Electronic component mounting package for mounting a light-emitting element, electronic device, and electronic module

Publication Date: 2023.01.10 KYOCERA CORP

AI summary

An electronic component mounting package includes: an insulating base body including a principal face and a recess which opens in the principal face; and a metallic pattern including a plurality of metallic layers lying across a side face of the recess and the principal face. The metallic pattern includes, as an inner layer, at least one metallic layer selected from a tungsten layer, a nickel layer, and a gold layer, and an aluminum layer as an outermost layer. The metallic pattern includes an exposed portion corresponding to a part of the metallic layer constituting the inner layer which part is exposed at the principal face.